Texas Instruments MSP430FR6972IPMR
MSP430FR6972IPMR
In Stock:94131
Qty
Unit Price
Ext Price
1
$4.030000
$4.030000
10
$3.806000
$38.060000
100
$3.590200
$359.020000
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Texas Instruments MSP430FR6972IPMR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 3 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
64-LQFP
Number of Pins
64
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Series
MSP430™ FRAM
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
64
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
2.2V
Frequency
16MHz
Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
MSP430
Pin Count
64
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
1.8V
Interface
I2C, IrDA, SCI, SPI, UART, USART
Memory Size
64kB
Oscillator Type
Internal
Number of I/O
51
RAM Size
2K x 8
Voltage - Supply (Vcc/Vdd)
1.8V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Core Processor
CPUXV2
Peripherals
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Program Memory Type
FRAM
Core Size
16-Bit
Program Memory Size
64KB 64K x 8
Connectivity
I2C, IrDA, SCI, SPI, UART/USART
Bit Size
16
Data Converter
A/D 8x12b
Has ADC
YES
DMA Channels
YES
PWM Channels
YES
DAC Channels
NO
Number of Timers/Counters
5
Boundary Scan
YES
Low Power Mode
YES
Number of UART Channels
2
Height
1.6mm
Length
10mm
Width
10mm
Thickness
1.4mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
MSP430FR6972IPMR Overview
Packaged in a 64-LQFP format. There are 51 I/O ports on this device. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 16-Bit core architecture. There is a FRAM type of memory for its program. The temperature range of this Microcontroller is within the range of -40°C~85°C TA. An electrical component of this type belongs to the MSP430™ FRAM series. This program memory has a size of 64KB 64K x 8, which indicates what the size of the program memory is. A CPUXV2 Core processor is used to power the device. The IC chip fits into the MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs category. There are 64 terminations on the IC chip. The part works on a 16-bit basis. The component always operates in 2.2V supply voltage. DMA channels number YES. 64kB is the size of the memory in the IC part. Alternatives can be found by looking at the base part number MSP430. This device is extremely efficient when operated at a frequency of 16MHz. In order for the device to work with the motor, it utilizes the PWM channel YES. It is possible to access the 64 pins on the chip. It is equipped with 5 timers and counters. 64 pins are counted on this board. It enjoys 2 UART channels.
MSP430FR6972IPMR Features
64-LQFP package
Mounting type of Surface Mount
MSP430FR6972IPMR Applications
There are a lot of Texas Instruments MSP430FR6972IPMR Microcontroller applications.
- Paper shredders
- Smoke alarms
- CD players
- Plant factories
- Smartphone
- Computed Tomography (CT scan)
- Answering machines
- Home appliances
- Kindle
- Ipad
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of I/OInterfaceMemory SizeSupply VoltagePeripheralsHeightView Compare
MSP430FR6972IPMR
NA64-LQFP
64
51
I2C, IrDA, SCI, SPI, UART, USART
64 kB
2.2 V
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
1.6 mm
- MSP430FR5872IPMRNA
64-LQFP
64
51
I2C, IrDA, SCI, SPI, UART, USART
64 kB
3 V
Brown-out Detect/Reset, DMA, POR, PWM, WDT
1.6 mm
MSP430FR6972IPMR
VS
MSP430FR5872IPMR
- MSP430FR5986IPMRNA
64-LQFP
64
48
I2C, IrDA, SPI, UART, USART
48 kB
3 V
Brown-out Detect/Reset, DMA, POR, PWM, WDT
1.6 mm
MSP430FR6972IPMR
VS
MSP430FR5986IPMR
MSP430F5504IPTRNA48-LQFP
48
31
I2C, IrDA, LIN, SCI, SPI, UART, USART, USB
8 kB
3 V
Brown-out Detect/Reset, DMA, POR, PWM, WDT
1.6 mm
MSP430FR6972IPMR
VS
MSP430F5504IPTR
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We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT, SF Express.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
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The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does ICHOME mainly purchase electronic components from?
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2.Are the Texas Instruments Incorporated (TI)'s MSP430FR6972IPMR price and stock displayed on the website accurate?
ICHOME inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with ICHOME salesperson or online customer service before payment.
You Also Ask
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
