Texas Instruments CDCM1802RGTT
CDCM1802RGTT
In Stock:94131
Qty
Unit Price
Ext Price
1
$6.860000
$6.860000
10
$6.469000
$64.690000
100
$6.103200
$610.320000
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Texas Instruments CDCM1802RGTT information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 4 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
16-VFQFN Exposed Pad
Number of Pins
16
Weight
22.906415mg
Operating Temperature
-40°C~85°C
Packaging
Cut Tape (CT)
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
2 (1 Year)
Number of Terminations
16
Termination
SMD/SMT
ECCN Code
EAR99
Type
Fanout Buffer (Distribution), Divider, Multiplexer
Subcategory
Clock Drivers
Packing Method
TR
Voltage - Supply
3V~3.6V
Terminal Position
QUAD
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
0.5mm
Frequency
800MHz
Base Part Number
CDCM1802
Output
LVCMOS, LVPECL
Pin Count
16
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3.3V
Supply Voltage-Min (Vsup)
3V
Number of Circuits
1
Nominal Supply Current
10μA
Propagation Delay
600 ps
Logic Function
Buffer, Clock
Input
LVCMOS, LVPECL, LVTTL
Ratio - Input:Output
1:2
Differential - Input:Output
Yes/Yes
Prop.
0.6 ns
Input Current
10μA
Height
1mm
Length
3mm
Width
3mm
Thickness
900μm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
CDCM1802RGTT Overview
As far as the case type is concerned, the cut smart buffer is available in 16-VFQFN Exposed Pad. It's?packaged?in?the?form?of?a Cut Tape (CT). A total of 16 terminations are present in it. With a voltage of 3.3V, high efficiency is possible. Consequently, it will be mounted by Surface Mount. This electronic part is classified as Fanout Buffer (Distribution), Divider, Multiplexer. Setting the temperature to -40°C~85°C will ensure reliable performance. In order for it to function, a power source of 3V~3.6V V must be available. It is placed in the way of Surface Mount. There is a pin count of 16 on timeing clock. As a result, it produces LVCMOS, LVPECL. During operation, 16 pins are used. Basically, it belongs to the same family as the CDCM1802. The cut smart buffer you are looking for is contained within Clock Drivers. The maximum supply voltage (Vsup) is set to 3.6V. It is recommended to keep the supply voltage (Vsup) above 3V to ensure normal operation. A 3.3V volt supply powers it. It maintains excellent accuracy at a frequency of 800MHz. This method employs the packing method of TR.
CDCM1802RGTT Features
16 terminations
The operating temperature of -40°C~85°C degrees
Clock Drivers subcategory
at 800MHz frequency
CDCM1802RGTT Applications
There are a lot of Texas Instruments CDCM1802RGTT Clock Buffers & Drivers applications.
- Tlecom applications
- Mobile Internet Device (MID)
- Cell Phone (UMTS/WCDMA/GSM)
- Zero crossing detector
- Artificial intelligence
- Internet of Things
- Patient diagnosis
- Medical instruments
- Synchronous digital system
- Hardware accelerator
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of CircuitsLogic FunctionSupply VoltageTerminal PitchWidthMounting TypeView Compare
CDCM1802RGTT
NA16-VFQFN Exposed Pad
16
1
Buffer, Clock
3.3 V
0.5 mm
3 mm
Surface Mount
NB7L14MNHTBGON Semiconductor16-VFQFN Exposed Pad
16
1
Buffer
2.5 V
0.5 mm
3 mm
Surface Mount
CDCM1802RGTT
VS
NB7L14MNHTBG
SY58011UMGMicrochip Technology16-VFQFN Exposed Pad, 16-MLF?
16
-
Clock
2.5 V
0.5 mm
3 mm
Surface Mount
CDCM1802RGTT
VS
SY58011UMG
- SY58021UMGMicrochip Technology
16-VFQFN Exposed Pad, 16-MLF?
16
-
Clock
2.5 V
0.5 mm
3 mm
Surface Mount
CDCM1802RGTT
VS
SY58021UMG
- SY89873LMGMicrochip Technology
16-VFQFN Exposed Pad, 16-MLF?
16
1
Clock
3.3 V
0.5 mm
3 mm
Surface Mount
CDCM1802RGTT
VS
SY89873LMG
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If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does ICHOME mainly purchase electronic components from?
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2.Are the Texas Instruments Incorporated (TI)'s CDCM1802RGTT price and stock displayed on the website accurate?
ICHOME inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with ICHOME salesperson or online customer service before payment.
You Also Ask
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
