Microchip Technology PIC24FJ64GB004-I/PT
PIC24FJ64GB004-I/PT
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Microchip Technology PIC24FJ64GB004-I/PT information
Type
Parameter
Factory Lead Time
17 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
44-TQFP
Number of Pins
44
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2008
Series
PIC® XLP™ 24F
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
44
Termination
SMD/SMT
Terminal Finish
Matte Tin (Sn)
Subcategory
Microcontrollers
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
2.5V
Terminal Pitch
0.8mm
Frequency
32MHz
Reflow Temperature-Max (s)
40
Base Part Number
PIC24FJ64GB004
Pin Count
44
Interface
I2C, IrDA, LIN, SPI, UART, USART, USB
Memory Size
64kB
Oscillator Type
Internal
Number of I/O
33
RAM Size
8K x 8
Voltage - Supply (Vcc/Vdd)
2V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Number of Bits
16
Core Processor
PIC
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
16-Bit
Program Memory Size
64KB 22K x 24
Connectivity
I2C, IrDA, SPI, UART/USART, USB OTG
Bit Size
16
Data Converter
A/D 13x10b
Watchdog Timer
Yes
Has ADC
YES
DMA Channels
NO
Data Bus Width
16b
Density
512 kb
CPU Family
PIC
Number of A/D Converters
1
Number of ADC Channels
13
Number of PWM Channels
5
Number of I2C Channels
2
Height
1.05mm
Length
10mm
Width
10mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
PIC24FJ64GB004-I/PT Overview
The package is 44-TQFP-shaped. In total, it has 33 inputs and outputs. In the case of the IC chip, the type of mounting is Surface Mount. Microcontroller is based on the 16-Bit core architecture. There is a FLASH type of memory for its program. The temperature range of this Microcontroller is within the range of -40°C~85°C TA. The electrical component that you are looking at belongs to the PIC® XLP™ 24F series of components. Microcontroller has abundant program memory size of 64KB 22K x 24. The PIC Core Processor powers the device and is one of its key features. MICROCONTROLLER uPs, uCs, and peripheral ICs make up the Microcontroller. Microcontroller is known that the chip has 44 terminations in total. You get a 16-bit size. There is an output of 2.5V volts from the Microcontroller chip. A total of NO DMA channels are available. This MCU is implemented with 64kB memory. Alternatives can be found by searching through the base part number PIC24FJ64GB004 to find them. A good performance can be achieved at a frequency of 32MHz, as long as it is operated at a low power consumption. The chip has 44 pins. The pin count is 44. This device is embedded with a PIC processor family, which is a powerful and efficient CPU. A total of 13 channels of ADC are available on this device. There are a total of 1 A/D converters on the device. The bits of the part is 16. An 5-channel PWM controller is used by the device. 2 channels of I2C have been incorporated into the design of the part.
PIC24FJ64GB004-I/PT Features
44-TQFP package
Mounting type of Surface Mount
Microcontrollers subcategory
PIC24FJ64GB004-I/PT Applications
There are a lot of Microchip Technology PIC24FJ64GB004-I/PT Microcontroller applications.
- Coffee machines
- Robots
- Fax machines
- Electromechanical control
- Leakage current tester
- Electrocardiogram (EKG)
- Current meter
- Hard drives
- Copiers
- DCS control intelligent sensor
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthNumber of I/OInterfaceMemory SizeSupply VoltagePeripheralsView Compare
PIC24FJ64GB004-I/PT
Microchip Technology44-TQFP
44
16 b
33
I2C, IrDA, LIN, SPI, UART, USART, USB
64 kB
2.5 V
Brown-out Detect/Reset, LVD, POR, PWM, WDT
- PIC24FJ48GA004-I/PTMicrochip Technology
44-TQFP
44
16 b
35
I2C, IrDA, SPI, UART, USART
48 kB
-
Brown-out Detect/Reset, LVD, POR, PWM, WDT
PIC24FJ64GB004-I/PT
VS
PIC24FJ48GA004-I/PT
- PIC24FJ32GA004-I/PTMicrochip Technology
44-TQFP
44
16 b
35
I2C, IrDA, SPI, UART, USART
32 kB
3.3 V
Brown-out Detect/Reset, LVD, POR, PWM, WDT
PIC24FJ64GB004-I/PT
VS
PIC24FJ32GA004-I/PT
- PIC24FJ32GB004-I/PTMicrochip Technology
44-TQFP
44
16 b
33
I2C, IrDA, SPI, UART, USART, USB
32 kB
-
Brown-out Detect/Reset, LVD, POR, PWM, WDT
PIC24FJ64GB004-I/PT
VS
PIC24FJ32GB004-I/PT
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2.Are the Microchip Technology's PIC24FJ64GB004-I/PT price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
