Microchip Technology PIC24FJ16GA002-I/SO
PIC24FJ16GA002-I/SO
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Microchip Technology PIC24FJ16GA002-I/SO information
Type
Parameter
Factory Lead Time
9 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
28-SOIC (0.295, 7.50mm Width)
Number of Pins
28
Operating Temperature
-40°C~85°C TA
Packaging
Tube
Published
2008
Series
PIC® 24F
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
28
Terminal Finish
Matte Tin (Sn)
Subcategory
Microcontrollers
Technology
CMOS
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Frequency
32MHz
Reflow Temperature-Max (s)
40
Base Part Number
PIC24FJ16GA002
Pin Count
28
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
2V
Interface
I2C, IrDA, SPI, UART, USART
Memory Size
16kB
Oscillator Type
Internal
Number of I/O
21
RAM Size
4K x 8
Voltage - Supply (Vcc/Vdd)
2V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Core Processor
PIC
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
16-Bit
Program Memory Size
16KB 5.5K x 24
Connectivity
I2C, PMP, SPI, UART/USART
Bit Size
16
Data Converter
A/D 10x10b
Watchdog Timer
Yes
Has ADC
YES
DMA Channels
NO
Data Bus Width
16b
ROM (words)
16384
CPU Family
PIC
Number of ADC Channels
10
Number of PWM Channels
5
Number of I2C Channels
2
Height
2.35mm
Length
17.9mm
Width
7.5mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
PIC24FJ16GA002-I/SO Overview
Packaged in a 28-SOIC (0.295, 7.50mm Width) format. In total, it has 21 inputs and outputs. It is important to note that the Microcontroller has a Surface Mount mounting type. Powered by the 16-Bit core, it offers a wide range of capabilities. The type of its program memory is FLASH. Temperatures in the range of -40°C~85°C TA are operated by this Microcontroller. PIC® 24F series components make up this electrical component. Microcontroller has abundant program memory size of 16KB 5.5K x 24. There is a PIC Core Processor inside MCU that provides this device with its power. The IC chip fits into the MICROCONTROLLER uPs/uCs/Peripheral ICs category. There are 28 terminations on the IC chip, which means there are 28 terminations on the integrated circuit chip. The part works on a 16-bit basis. A total of NO DMA channels are available on MCU chip. This IC part has a memory size of 16kB. PIC24FJ16GA002 is the base part number that you can use to find alternatives. A good performance can be achieved at a frequency of 32MHz, as long as it is operated at a low power consumption. On the chip, 28 pins are accessible. The pins counted are 28. In addition to this, the device is embedded with the the PIC CPU family. A total of 10 channels of ADC are available on this device. This device uses 5 PWM channels to generate the voltage. In this device, there's an 2-channel PWM controller.
PIC24FJ16GA002-I/SO Features
28-SOIC (0.295, 7.50mm Width) package
Mounting type of Surface Mount
Microcontrollers subcategory
PIC24FJ16GA002-I/SO Applications
There are a lot of Microchip Technology PIC24FJ16GA002-I/SO Microcontroller applications.
- DDC control
- Heart rate monitors
- 3D printers
- Dialysis machines
- Gas monitoring systems
- Television
- Dishwashers
- Routers
- Automatic braking system
- Calculators
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthNumber of I/OInterfaceMemory SizePeripheralsTechnologyView Compare
PIC24FJ16GA002-I/SO
Microchip Technology28-SOIC (0.295, 7.50mm Width)
28
16 b
21
I2C, IrDA, SPI, UART, USART
16 kB
Brown-out Detect/Reset, LVD, POR, PWM, WDT
CMOS
- PIC24FJ64GA002-I/SOMicrochip Technology
28-SOIC (0.295, 7.50mm Width)
28
16 b
21
I2C, IrDA, SPI, UART, USART
64 kB
Brown-out Detect/Reset, LVD, POR, PWM, WDT
CMOS
PIC24FJ16GA002-I/SO
VS
PIC24FJ64GA002-I/SO
- PIC24F16KA102-I/SOMicrochip Technology
28-SOIC (0.295, 7.50mm Width)
28
16 b
24
I2C, IrDA, SPI, UART, USART
16 kB
Brown-out Detect/Reset, POR, PWM, WDT
CMOS
PIC24FJ16GA002-I/SO
VS
PIC24F16KA102-I/SO
- PIC24FJ32GA002-I/SOMicrochip Technology
28-SOIC (0.295, 7.50mm Width)
28
16 b
21
I2C, IrDA, SPI, UART, USART
32 kB
Brown-out Detect/Reset, LVD, POR, PWM, WDT
CMOS
PIC24FJ16GA002-I/SO
VS
PIC24FJ32GA002-I/SO
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
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3. Where does ICHOME mainly purchase electronic components from?
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2.Are the Microchip Technology's PIC24FJ16GA002-I/SO price and stock displayed on the website accurate?
ICHOME inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with ICHOME salesperson or online customer service before payment.
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
