Texas Instruments CDCLVC1310RHBR
CDCLVC1310RHBR
In Stock:94131
Qty
Unit Price
Ext Price
1
$8.270000
$8.270000
10
$7.806000
$78.060000
100
$7.363900
$736.390000
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Texas Instruments CDCLVC1310RHBR information
Type
Parameter
Factory Lead Time
12 Weeks
Lifecycle Status
ACTIVE (Last Updated: 5 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
32-VFQFN Exposed Pad
Number of Pins
32
Operating Temperature
-40°C~85°C
Packaging
Tape & Reel (TR)
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
2 (1 Year)
Number of Terminations
32
ECCN Code
EAR99
Type
Fanout Buffer (Distribution), Multiplexer
Additional Feature
ALSO OPERATES IN 3.3 V
Subcategory
Clock Drivers
Packing Method
TR
Voltage - Supply
2.375V~3.465V
Terminal Position
QUAD
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
2.5V
Frequency
200MHz
Base Part Number
CDCLVC1310
Output
LVCMOS
Pin Count
32
Number of Outputs
10
Supply Voltage-Max (Vsup)
2.625V
Power Supplies
2.5/3.3V
Supply Voltage-Min (Vsup)
2.375V
Number of Circuits
1
Propagation Delay
2 ns
Turn On Delay Time
2 ns
Family
CDC
Input
HCSL, LVCMOS, LVDS, LVPECL, SSTL, Crystal
Ratio - Input:Output
3:10
Max I(ol)
0.024 A
Differential - Input:Output
Yes/No
Same Edge Skew-Max (tskwd)
0.05 ns
Duty Cycle
55 %
Height
1mm
Length
5mm
Width
5mm
Thickness
900μm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
texasinstruments-trf370417irget-datasheets-0676.pdf
texasinstruments-cdclvc1310rhbr-datasheets-9728.pdf
texasinstruments-cdclvc1310rhbr-datasheets-9729.pdf
- PCN Design/Specification :
texasinstruments-sn74hc373n-pcndesignspecification-9663.pdf
texasinstruments-trf37d73idsgt-pcndesignspecification-4397.pdf
CDCLVC1310RHBR Overview
It is available in the case 32-VFQFN Exposed Pad for this cut smart buffer. In case Tape & Reel (TR), the cut smart buffer is available. A total of 32 terminations are present. It is possible to achieve high efficiency with a 2.5V supply voltage. A mount of Surface Mount has been applied to it. This electronic component falls under the classification of Fanout Buffer (Distribution), Multiplexer. Setting the temperature to -40°C~85°C will ensure reliable performance. 2.375V~3.465V V power should work with it. In the direction of Surface Mount, it is placed. The clock buffer contains 32 pins. There is a value of LVCMOS as the output. During operation, 32 pins are used. This object belongs to the CDCLVC1310 family. There is a cut smart buffer contained in Clock Drivers that is used for this purpose. A member of the CDC family, this gadget is a timeing clock. In this case, Vsup will be set to 2.625V (decimal). For normal operation, the supply voltage (Vsup) should be kept above 2.375V. By default, output 10 is set. There is a 2.5/3.3V volt supply attached to it. As a result of using this gadget, you will also be able to obtain ALSO OPERATES IN 3.3 V. An excellent degree of accuracy can be maintained at a frequency of 200MHz. This method entails the use of the TR packing method.
CDCLVC1310RHBR Features
32 terminations
The operating temperature of -40°C~85°C degrees
Clock Drivers subcategory
at 200MHz frequency
CDCLVC1310RHBR Applications
There are a lot of Texas Instruments CDCLVC1310RHBR Clock Buffers & Drivers applications.
- High-performance workstation
- Telecommunications
- Edge computing
- Consumer Electronics
- Car
- High speed line receiver
- Industrial automation control system
- Oscilloscope and logic analyzer front ends
- Navigation equipment
- High-speed flip-flop
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of CircuitsSupply VoltageMountLead FreePbfree CodeView Compare
CDCLVC1310RHBR
NA32-VFQFN Exposed Pad
32
1
2.5 V
Surface Mount
Lead Free
yes
CDCLVD1208RHDTNA28-VFQFN Exposed Pad
28
1
2.5 V
Surface Mount
Lead Free
yes
CDCLVC1310RHBR
VS
CDCLVD1208RHDT
CDCVF857RHATNA40-VFQFN Exposed Pad
40
1
2.5 V
Surface Mount
Lead Free
yes
CDCLVC1310RHBR
VS
CDCVF857RHAT
8SLVD1208NBGIIntegrated Device Technology (IDT)VQFN
28
1
2.5 V
Surface Mount
Lead Free
yes
CDCLVC1310RHBR
VS
8SLVD1208NBGI
8SLVD1208NBGI8Integrated Device Technology (IDT)VQFN
28
1
2.5 V
Surface Mount
Lead Free
yes
CDCLVC1310RHBR
VS
8SLVD1208NBGI8
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How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT, SF Express.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does ICHOME mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s CDCLVC1310RHBR price and stock displayed on the website accurate?
ICHOME inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with ICHOME salesperson or online customer service before payment.
You Also Ask
Need Any Service, please feel free contact us: sales@ichome.com
After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
