Texas Instruments CDCLVP1216RGZT
CDCLVP1216RGZT
In Stock:94131
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Unit Price
Ext Price
1
$21.710000
$21.710000
10
$20.485000
$204.850000
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Texas Instruments CDCLVP1216RGZT information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 6 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
48-VFQFN Exposed Pad
Number of Pins
48
Weight
138.005479mg
Operating Temperature
-40°C~85°C
Packaging
Tape & Reel (TR)
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
48
Termination
SMD/SMT
ECCN Code
EAR99
Type
Fanout Buffer (Distribution), Multiplexer
Additional Feature
DUMMY VAL
Subcategory
Clock Drivers
Packing Method
TR
Voltage - Supply
2.375V~3.6V
Terminal Position
QUAD
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
2.5V
Terminal Pitch
0.5mm
Frequency
2GHz
Base Part Number
CDCLVP1216
Output
LVPECL
Pin Count
48
Number of Outputs
16
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
2.5/3.3V
Supply Voltage-Min (Vsup)
2.375V
Number of Circuits
1
Nominal Supply Current
110mA
Propagation Delay
550 ps
Quiescent Current
618mA
Turn On Delay Time
550 ps
Family
CDC
Input
LVCMOS, LVDS, LVPECL, LVTTL
Ratio - Input:Output
2:16
Differential - Input:Output
Yes/Yes
Prop.
0.55 ns
Input Current
40μA
fmax-Min
2000 MHz
Same Edge Skew-Max (tskwd)
0.03 ns
Duty Cycle
50 %
Height
1mm
Length
7mm
Width
7mm
Thickness
900μm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
texasinstruments-trf370417irget-datasheets-0676.pdf
texasinstruments-cdclvp1216rgzt-datasheets-1763.pdf
texasinstruments-cdclvp1216rgzt-datasheets-1764.pdf
- PCN Design/Specification :
texasinstruments-ths9000drwt-pcndesignspecification-5200.pdf
texasinstruments-ths9000drwt-pcndesignspecification-5201.pdf
- PCN Packaging :
CDCLVP1216RGZT Overview
48-VFQFN Exposed Pad case is available for the cut smart buffer. There is a Tape & Reel (TR) packaged with it. A total of 48 terminations can be found in it. Using a supply voltage of 2.5V allows for high efficiency. A mount of Surface Mount has been applied to it. This electronic component falls under the classification of Fanout Buffer (Distribution), Multiplexer. If you wish to ensure reliable performance, you should set the temperature to -40°C~85°C. Ideally, it should be able to operate from 2.375V~3.6V volts. It is located in the way of Surface Mount. The pin count is 48. There is an output of LVPECL. Operation is performed using the 48 pins. Basically, it belongs to the same family as the CDCLVP1216. The cut smart buffer you are looking for is contained within Clock Drivers. The gadget belongs to the CDC family. The maximum supply voltage (Vsup) has been set to 3.6V. For normal operation, the supply voltage (Vsup) should be kept above 2.375V. As a default, it is set to output 16 by default. There is a 2.5/3.3V volt supply attached to it. You can also get DUMMY VAL when you use this gadget. There is no external influence on it, as it consumes 618mA quiescent current. The frequency of 2GHz maintains excellent accuracy. This method entails the use of the TR packing method.
CDCLVP1216RGZT Features
48 terminations
The operating temperature of -40°C~85°C degrees
Clock Drivers subcategory
at 2GHz frequency
CDCLVP1216RGZT Applications
There are a lot of Texas Instruments CDCLVP1216RGZT Clock Buffers & Drivers applications.
- Storage area network
- High performance communication system
- DDR4 JEDEC standard RDIMM design
- Automatic test equipment
- Industrial automation control system
- High-end consumer electronics
- Window comparator
- Oscilloscope and logic analyzer front ends
- Hardware accelerator
- Network
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of CircuitsSupply VoltageTerminal PitchMountThicknessMoisture Sensitivity Level (MSL)View Compare
CDCLVP1216RGZT
NA48-VFQFN Exposed Pad
48
1
2.5 V
0.5 mm
Surface Mount
900 μm
3 (168 Hours)
- CDCLVD1216RGZTNA
48-VFQFN Exposed Pad
48
1
2.5 V
0.5 mm
Surface Mount
900 μm
3 (168 Hours)
CDCLVP1216RGZT
VS
CDCLVD1216RGZT
- CDCLVD1216RGZRNA
48-VFQFN Exposed Pad
48
1
2.5 V
0.5 mm
Surface Mount
900 μm
3 (168 Hours)
CDCLVP1216RGZT
VS
CDCLVD1216RGZR
CDCVF857RHATNA40-VFQFN Exposed Pad
40
1
2.5 V
0.5 mm
Surface Mount
900 μm
3 (168 Hours)
CDCLVP1216RGZT
VS
CDCVF857RHAT
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How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT, SF Express.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does ICHOME mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s CDCLVP1216RGZT price and stock displayed on the website accurate?
ICHOME inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with ICHOME salesperson or online customer service before payment.
You Also Ask
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
