Microchip Technology PIC16F887-I/P
PIC16F887-I/P
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Microchip Technology PIC16F887-I/P information
Type
Parameter
Factory Lead Time
6 Weeks
Mount
Through Hole
Mounting Type
Through Hole
Package / Case
40-DIP (0.600, 15.24mm)
Number of Pins
40
Weight
22.679619g
Operating Temperature
-40°C~85°C TA
Packaging
Tube
Published
2007
Series
PIC® 16F
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
40
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn) - annealed
Subcategory
Microcontrollers
Max Power Dissipation
800mW
Technology
CMOS
Terminal Position
DUAL
Supply Voltage
5V
Terminal Pitch
2.54mm
Frequency
20MHz
Base Part Number
PIC16F887
Pin Count
40
Supply Voltage-Max (Vsup)
5.5V
Power Supplies
2.5/5V
Supply Voltage-Min (Vsup)
4.5V
Interface
I2C, SPI, UART, USART
Memory Size
14kB
Oscillator Type
Internal
Number of I/O
35
Nominal Supply Current
220μA
RAM Size
368 x 8
Voltage - Supply (Vcc/Vdd)
2V~5.5V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Number of Bits
8
Core Processor
PIC
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
8-Bit
Program Memory Size
14KB 8K x 14
Connectivity
I2C, SPI, UART/USART
Bit Size
8
Data Converter
A/D 14x10b
Watchdog Timer
Yes
Access Time
20 μs
Has ADC
YES
DMA Channels
NO
Data Bus Width
8b
PWM Channels
YES
Number of Timers/Counters
3
Address Bus Width
8b
EEPROM Size
256 x 8
CPU Family
PIC
Number of A/D Converters
1
Number of Programmable I/O
36
Number of ADC Channels
14
Height
4.953mm
Length
53.21mm
Width
14.732mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
PIC16F887-I/P Overview
The package is in 40-DIP (0.600, 15.24mm) format. This Microcontroller has 35 I/Os. It is important to note that the Microcontroller has a Through Hole mounting type. The 8-Bit core is the core of the MCU. There is a FLASH type of memory for its program. The Microcontroller runs in -40°C~85°C TA Operating Temperature. Microcontroller runs in PIC® 16F Series. The electronic part has a program memory size of 14KB 8K x 14. There's a PIC Core Processor inside. This device belongs to the MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs category. IC Chip 40 has 40 terminations. A 8-bit operation is performed by this part. IC Chip has 5V volt supply outputs. In addition to that, MCU chip has NO DMA channels. Its memory size is 14kB. The base part number PIC16F887 can be used to find alternatives. MCU's frequency is 20MHz. There are a total of YES channels in the device. On the chip, 40 pins are accessible. There are 3 timers/counters in this device. A total of 40 pins are present. There is an embedded the PIC CPU family inside the device, which makes it a powerful device. In the 36 Programmable I/O section, it can be programmed in many different ways. The ADC channels on this device total 14 in number. The device contains 1 A/D converters. 8 bits are found on a chip.
PIC16F887-I/P Features
40-DIP (0.600, 15.24mm) package
Mounting type of Through Hole
Microcontrollers subcategory
PIC16F887-I/P Applications
There are a lot of Microchip Technology PIC16F887-I/P Microcontroller applications.
- Automatic control
- Automatic braking system
- Heart rate monitors
- Gas monitoring systems
- Toasters
- Graphic terminals
- Virtual reality VR robots
- Fire alarms
- Playstation
- Toys
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthNumber of I/OInterfaceMemory SizeSupply VoltagePeripheralsView Compare
PIC16F887-I/P
Microchip Technology40-DIP (0.600, 15.24mm)
40
8 b
35
I2C, SPI, UART, USART
14 kB
5 V
Brown-out Detect/Reset, POR, PWM, WDT
- PIC16F1519-I/PMicrochip Technology
40-DIP (0.600, 15.24mm)
40
8 b
36
I2C, LIN, SPI, UART, USART
28 kB
-
Brown-out Detect/Reset, POR, PWM, WDT
PIC16F887-I/P
VS
PIC16F1519-I/P
- PIC16F917-I/PMicrochip Technology
40-DIP (0.600, 15.24mm)
40
8 b
35
I2C, SPI, SSP, UART, USART
14 kB
5 V
Brown-out Detect/Reset, LCD, POR, PWM, WDT
PIC16F887-I/P
VS
PIC16F917-I/P
- PIC16F884-I/PMicrochip Technology
40-DIP (0.600, 15.24mm)
40
8 b
35
I2C, SPI, UART, USART
7 kB
5 V
Brown-out Detect/Reset, POR, PWM, WDT
PIC16F887-I/P
VS
PIC16F884-I/P
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2.Are the Microchip Technology's PIC16F887-I/P price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
