Microchip Technology AT89C51RC2-SLSUM
AT89C51RC2-SLSUM
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Microchip Technology AT89C51RC2-SLSUM information
Type
Parameter
Factory Lead Time
6 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
44-LCC (J-Lead)
Number of Pins
44
Operating Temperature
-40°C~85°C TA
Packaging
Tube
Published
1997
Series
89C
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
44
Subcategory
Microcontrollers
Max Power Dissipation
1W
Technology
CMOS
Terminal Position
QUAD
Terminal Form
J BEND
Peak Reflow Temperature (Cel)
245
Supply Voltage
5V
Terminal Pitch
1.27mm
Frequency
60MHz
Reflow Temperature-Max (s)
40
Base Part Number
AT89C51RC2
Supply Voltage-Max (Vsup)
5.5V
Supply Voltage-Min (Vsup)
2.7V
Interface
SPI, UART, USART
Memory Size
32kB
Oscillator Type
External
Number of I/O
32
Speed
40 MHz
RAM Size
1.25K x 8
Voltage - Supply (Vcc/Vdd)
2.7V~5.5V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Core Processor
80C51
Peripherals
POR, PWM, WDT
Program Memory Type
FLASH
Core Size
8-Bit
Program Memory Size
32KB 32K x 8
Connectivity
SPI, UART/USART
Supply Current-Max
29mA
Bit Size
8
Watchdog Timer
Yes
Access Time
60 μs
Has ADC
NO
DMA Channels
NO
Data Bus Width
8b
PWM Channels
YES
DAC Channels
NO
Number of Timers/Counters
3
Address Bus Width
16
Core Architecture
8051
Height Seated (Max)
4.57mm
Length
16.55mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
microchiptechnology-ata8204p3ctkqw-pcndesignspecification-9786.pdf
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
AT89C51RC2-SLSUM Overview
The package is in 44-LCC (J-Lead) format. 32 I/Os are available. The Mounting Type of the Microcontroller is Surface Mount. The 8-Bit core is the core of the MCU. There is a FLASH type of memory for its program. -40°C~85°C TA is the temperature range at which this Microcontroller operates. The 89C series includes this electrical component. Its program memory size is 32KB 32K x 8. A 80C51 Core processor is used to power the device. This Microcontroller belongs to the MICROCONTROLLER uPs/uCs/peripheral ICs type. IC Chip terminations are 44. 8-bits are used for its size. The component always operates in 5V supply voltage. With NO DMA channels, Microcontroller chip can handle large data transfers. There is 32kB memory size assigned to the part. The base part number AT89C51RC2 provides alternatives. MCU's frequency is 60MHz. It is possible for the device to work with the motor using the PWM channel YES. In this chip, 44 pins can be accessed. It is equipped with 3 timers and counters. As a result of its 8051 core architecture, it can be used in many applications.
AT89C51RC2-SLSUM Features
44-LCC (J-Lead) package
Mounting type of Surface Mount
Microcontrollers subcategory
AT89C51RC2-SLSUM Applications
There are a lot of Microchip Technology AT89C51RC2-SLSUM Microcontroller applications.
- Gas monitoring systems
- Fire alarms
- Traditional industrial transformation
- Guidance-GPS
- Kindle
- Scanners
- Keyboards
- Dryers
- Removable disks
- Pacemakers
- ImagePart NumberManufacturerPackage / CaseNumber of PinsCore ArchitectureData Bus WidthNumber of I/OInterfaceMemory SizeSupply VoltageView Compare
AT89C51RC2-SLSUM
Microchip Technology44-LCC (J-Lead)
44
8051
8 b
32
SPI, UART, USART
32 kB
5 V
- AT89C51IC2-SLSUMMicrochip Technology
44-LCC (J-Lead)
44
8051
8 b
34
I2C, SPI, UART, USART
32 kB
5 V
AT89C51RC2-SLSUM
VS
AT89C51IC2-SLSUM
- AT89C51IC2-SLRULMicrochip Technology
44-LCC (J-Lead)
44
8051
8 b
34
I2C, SPI, UART, USART
32 kB
3 V
AT89C51RC2-SLSUM
VS
AT89C51IC2-SLRUL
- AT89C51IC2-SLRUMMicrochip Technology
44-LCC (J-Lead)
44
8051
8 b
34
I2C, SPI, UART, USART
32 kB
5 V
AT89C51RC2-SLSUM
VS
AT89C51IC2-SLRUM
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
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