Microchip Technology PIC32MX460F512L-80I/PT
PIC32MX460F512L-80I/PT
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Microchip Technology PIC32MX460F512L-80I/PT information
Type
Parameter
Factory Lead Time
16 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
100-TQFP
Number of Pins
100
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2007
Series
PIC® 32MX
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
100
Termination
SMD/SMT
Subcategory
Microcontrollers
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.4mm
Frequency
80MHz
Reflow Temperature-Max (s)
40
Base Part Number
PIC32MX460F512L
Pin Count
100
Supply Voltage-Max (Vsup)
3.6V
Interface
I2C, IrDA, LIN, SPI, UART, USART, USB
Memory Size
512kB
Oscillator Type
Internal
Number of I/O
85
Nominal Supply Current
24mA
RAM Size
32K x 8
Voltage - Supply (Vcc/Vdd)
2.3V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Number of Bits
32
Core Processor
MIPS32® M4K™
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
32-Bit
Program Memory Size
512KB 512K x 8
Connectivity
I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Bit Size
32
Data Converter
A/D 16x10b
Watchdog Timer
Yes
Has ADC
YES
DMA Channels
YES
Data Bus Width
32b
Address Bus Width
32b
Density
4 Mb
Core Architecture
PIC
CPU Family
PIC
Number of A/D Converters
1
Number of ADC Channels
16
Number of PWM Channels
5
Number of USB Channels
2
Height
1.05mm
Length
12mm
Width
12mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Design Resources :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
PIC32MX460F512L-80I/PT Overview
100-TQFP-packages are available. This Microcontroller has 85 I/Os. Using the Mounting Type Surface Mount, the MCU is mounted on PCB. 32-Bit core is the basis for this Microcontroller. The type of program memory it uses is FLASH. There is a temperature range of -40°C~85°C TA that is operated by this Microcontroller. PIC® 32MX-series components are electrical components. Its program memory size is 512KB 512K x 8. There is a MIPS32® M4K™ Core Processor inside MCU that provides this device with its power. This device belongs to the MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs category. During the manufacturing process, 100 terminations were applied to the IC chip. This part works in a 32-bit manner. There is an output of 3.3V volts from the Microcontroller chip. A total of YES DMA channels are available on MCU chip. The part owns 512kB memory size. There are a number of alternatives to the base part number PIC32MX460F512L that you can find. A good performance can be achieved at a frequency of 80MHz, as long as it is operated at a low power consumption. The chip has 100 pins. A total of 100 pins are included in the package. There is an embedded the PIC CPU family inside the device, which makes it a powerful device. It has a PIC core architecture integrated into it. There are a total of 16 channels for the ADC on this board, so it has a total of 16 channels. The Microcontroller has 1 A/D converters. IC chip bits total 32. A total of 5 PWM channels are used by the device.
PIC32MX460F512L-80I/PT Features
100-TQFP package
Mounting type of Surface Mount
Microcontrollers subcategory
PIC32MX460F512L-80I/PT Applications
There are a lot of Microchip Technology PIC32MX460F512L-80I/PT Microcontroller applications.
- DVDDVMP3 players
- Electromechanical control
- Data acquisition and control
- Guidance-GPS
- Walkie talkies
- Electrocardiogram (EKG)
- Fax machines
- Process control devices
- X-ray
- Petrochemical
- ImagePart NumberManufacturerPackage / CaseNumber of PinsCore ArchitectureData Bus WidthInterfaceSupply VoltageFrequencyBit SizeView Compare
PIC32MX460F512L-80I/PT
Microchip Technology100-TQFP
100
PIC
32 b
I2C, IrDA, LIN, SPI, UART, USART, USB
3.3 V
80 MHz
32
SIM3C167-B-GQSilicon Labs80-TQFP
80
ARM
32 b
EBI/EMI, I2C, I2S, IrDA, SPI, UART, USART
3 V
80 MHz
32
PIC32MX460F512L-80I/PT
VS
SIM3C167-B-GQ
- PIC32MX360F512L-80I/PTMicrochip Technology
100-TQFP
100
PIC
32 b
I2C, IrDA, LIN, SPI, UART, USB
3.3 V
80 MHz
32
PIC32MX460F512L-80I/PT
VS
PIC32MX360F512L-80I/PT
- PIC32MX340F128L-80I/PTMicrochip Technology
100-TQFP
100
PIC
32 b
I2C, IrDA, LIN, SPI, UART, USART, USB
3.3 V
80 MHz
32
PIC32MX460F512L-80I/PT
VS
PIC32MX340F128L-80I/PT
- PIC32MX360F256L-80I/PTMicrochip Technology
100-TQFP
100
PIC
32 b
I2C, IrDA, LIN, SPI, UART, USART, USB
3.3 V
80 MHz
32
PIC32MX460F512L-80I/PT
VS
PIC32MX360F256L-80I/PT
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2.Are the Microchip Technology's PIC32MX460F512L-80I/PT price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
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4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
