Microchip Technology SY89871UMG
SY89871UMG
In Stock:94131
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Unit Price
Ext Price
1
$18.470000
$18.470000
10
$17.429000
$174.290000
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Microchip Technology SY89871UMG information
Type
Parameter
Factory Lead Time
6 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
16-VFQFN Exposed Pad, 16-MLF®
Number of Pins
16
Operating Temperature
-40°C~85°C
Packaging
Tube
Published
2000
Series
Precision Edge®
JESD-609 Code
e4
Part Status
Active
Moisture Sensitivity Level (MSL)
2 (1 Year)
Number of Terminations
16
ECCN Code
EAR99
Type
Fanout Buffer (Distribution), Divider
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Packing Method
TR
Voltage - Supply
2.375V~3.63V
Terminal Position
QUAD
Number of Functions
1
Supply Voltage
2.5V
Terminal Pitch
0.5mm
Frequency
2.5GHz
Base Part Number
SY89871
Output
LVPECL
Number of Outputs
3
Operating Supply Voltage
3.6V
Number of Circuits
1
Nominal Supply Current
50mA
Quiescent Current
75mA
Logic Function
Buffer, Clock
Max Input Voltage
4.3V
Input
CML, HSTL, LVDS, LVPECL
Ratio - Input:Output
1:3
Differential - Input:Output
Yes/Yes
fmax-Min
2500 MHz
Height
800μm
Length
3mm
Width
3mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
microchiptechnology-sy89871umgtr-datasheets-1740.pdf
microchip-sy89871umg-datasheets-0168.pdf
microchip-sy89871umg-datasheets-0169.pdf
microchip-sy89871umg-datasheets-0170.pdf
microchip-sy89871umg-datasheets-0171.pdf
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
SY89871UMG Overview
The clock divider is packaged in a 16-VFQFN Exposed Pad, 16-MLF? case. It is available in the case Tube. There are 16 terminations in it. High efficiency is feasible with a supply voltage of 2.5V. The mount is made up of Surface Mount. Electronic components classified as Fanout Buffer (Distribution), Divider fall into this category. It is recommended to set the temperature to -40°C~85°C in order to achieve reliable performance. It should be capable of operating with a power supply of 2.375V~3.63V volts. This item is positioned in the way of Surface Mount. As a result, it produces LVPECL. The 16 pins are used for operation. It belongs to the family SY89871. As a default, it outputs 3. In this case, the electronic part belongs to the Precision Edge? series. A voltage of 3.6V is recommended for maximum efficiency. It consumes 75mA quiescent current and is unaffected by external factors. With a frequency of 2.5GHz, it is capable of maintaining excellent accuracy. It is based on the TR packing method. An input voltage of 4.3V is its maximum.
SY89871UMG Features
16 terminations
The operating temperature of -40°C~85°C degrees
at 2.5GHz frequency
SY89871UMG Applications
There are a lot of Microchip Technology SY89871UMG Clock Buffers & Drivers applications.
- High speed line receiver
- Furniture
- Synchronous optical network (SONET)
- Microserver
- Handheld test instruments
- Medical instruments
- High-performance server
- Peak detection
- Switch
- Gigabit Ethernet (GbE)
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of CircuitsLogic FunctionQuiescent CurrentSupply VoltageFactory Lead TimeWidthView Compare
SY89871UMG
Microchip Technology16-VFQFN Exposed Pad, 16-MLF?
16
1
Buffer, Clock
75 mA
2.5 V
6 Weeks
3 mm
SI53340-B-GMSilicon Labs16-VFQFN Exposed Pad
16
1
Clock
-
1.8 V
6 Weeks
3 mm
SY89871UMG
VS
SI53340-B-GM
- SY58608UMGMicrochip Technology
16-VFQFN Exposed Pad, 16-MLF?
16
-
Buffer
-
2.5 V
6 Weeks
3 mm
SY89871UMG
VS
SY58608UMG
- SI53306-B-GMSilicon Labs
16-VFQFN Exposed Pad
16
-
Clock, Translator
100 mA
1.8 V
6 Weeks
3 mm
SY89871UMG
VS
SI53306-B-GM
- SI53322-B-GMSilicon Labs
16-VFQFN Exposed Pad
16
1
Clock
-
2.5 V
6 Weeks
3 mm
SY89871UMG
VS
SI53322-B-GM
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2.Are the Microchip Technology's SY89871UMG price and stock displayed on the website accurate?
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You Also Ask
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
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4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
