Xilinx Inc. XC7Z100-2FFG900I
XC7Z100-2FFG900I
In Stock:94131
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Xilinx Inc. XC7Z100-2FFG900I information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Package / Case
900-BBGA, FCBGA
Number of Pins
900
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2010
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
900
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
1V
Terminal Pitch
1mm
Frequency
800MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC7Z100
Supply Voltage-Max (Vsup)
1.05V
Supply Voltage-Min (Vsup)
0.95V
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
212
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Boundary Scan
YES
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 444K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
3.35mm
Length
31mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq?-7000 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines Kintex?-7 FPGA, 444K Logic Cells.It is packaged in a state-of-the-art Tray package.This SoC part has a total of 212 I/Os.It is recommended to use a 1V power supply.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.At least 0.95V can be supplied as a power source.Having 900 terminations in total makes system on a chip possible.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z100.There is 800MHz frequency associated with the wireless SoC.This SoC meaning utilizes a core architecture of ARM as its foundation.The computer SoC has a pin count of 900.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z100-2FFG900I System On Chip (SoC) applications.
- High-end PLC
- Industrial automation devices
- Wireless sensor networks
- Samsung galaxy gear
- CNC control
- Industrial sectors
- Medical
- Industrial
- Robotics
- Video Imaging
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2.Are the Xilinx's XC7Z100-2FFG900I price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
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4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
