Xilinx Inc. XC7Z030-2FBG484I
XC7Z030-2FBG484I
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Xilinx Inc. XC7Z030-2FBG484I information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Package / Case
484-BBGA, FCBGA
Surface Mount
YES
Number of Pins
484
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2009
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
484
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
1V
Terminal Pitch
1mm
Frequency
800MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC7Z030
Operating Supply Voltage
1V
Supply Voltage-Max (Vsup)
1.05V
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-2
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
2.54mm
Length
23mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.Its package is 484-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with reliable performance.Internally, this SoC design uses the MCU, FPGA technique.Featured system on chip SoCs of the Zynq?-7000 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.This SoC security combines Kintex?-7 FPGA, 125K Logic Cells and that is something to note.Housed in the state-of-art Tray package.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.The SoCs wireless is considered unreliable if the voltage exceeds 1.05V.In total, there are 484 terminations, which makes system on a chip possible.Search XC7Z030 for system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 800MHz is what the wireless SoC does.There is no doubt that the SoC meaning is based on the core architecture of ARM.The computer SoC is the 484-pin version.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-2FBG484I System On Chip (SoC) applications.
- Industrial automation devices
- Video Imaging
- Wireless sensor networks
- Published Paper
- Functional safety for critical applications in the automotive
- Medical
- Three phase UPS
- Mobile computing
- Microcontroller based SoC ( RISC-V, ARM)
- Automotive
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of I/OPeripheralsSupply VoltageTerminal PitchOperating Supply VoltageTerminal FormView Compare
XC7Z030-2FBG484I
Xilinx Inc.484-BBGA, FCBGA
484
130
DMA
1 V
1 mm
1 V
BALL
- XC7Z030-1FBG484IXilinx Inc.
484-BBGA, FCBGA
484
130
DMA
1 V
1 mm
1 V
BALL
XC7Z030-2FBG484I
VS
XC7Z030-1FBG484I
- XC7Z030-3FBG484EXilinx Inc.
484-BBGA, FCBGA
484
130
DMA
1 V
1 mm
1 V
BALL
XC7Z030-2FBG484I
VS
XC7Z030-3FBG484E
- XC7Z030-1FBG484CXilinx Inc.
484-BBGA, FCBGA
484
130
DMA
1 V
1 mm
1 V
BALL
XC7Z030-2FBG484I
VS
XC7Z030-1FBG484C
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