Xilinx Inc. XC7Z020-2CLG484I
Please send RFQ , we will respond immediately.
Xilinx Inc. XC7Z020-2CLG484I information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Package / Case
484-LFBGA, CSPBGA
Surface Mount
YES
Number of Pins
484
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2009
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
484
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code
8542.39.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1V
Terminal Pitch
0.8mm
Frequency
766MHz
Base Part Number
XC7Z020
Operating Supply Voltage
1V
Supply Voltage-Max (Vsup)
1.05V
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-2
RAM (words)
256000
Primary Attributes
Artix™-7 FPGA, 85K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max)
1.6mm
Length
19mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.According to the manufacturer, this system on a chip has a package of 484-LFBGA, CSPBGA.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.In the Zynq?-7000 series, this system on chip SoC is included.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.There is one thing to note about this SoC security: it combines Artix?-7 FPGA, 85K Logic Cells.An advanced Tray package houses this SoC system on a chip.This SoC part has a total of 130 I/Os.It is advised to utilize a 1V power supply.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.There are 484 terminations in total and that really benefits system on a chip.Searching XC7Z020 will yield system on chips with similar specs and purposes.A frequency of 766MHz is used by the wireless SoC to operate.Core architecture of ARM underpins the SoC meaning.Currently, the computer SoC is available in a 484-pin version.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z020-2CLG484I System On Chip (SoC) applications.
- RISC-V
- Embedded systems
- Flow Sensors
- ARM support modules
- Medical
- Keyboard
- Deep learning hardware
- Industrial sectors
- Special Issue Information
- Digital Signal Processing
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of I/ORAM SizeSupply VoltagePeripheralsTerminal PositionPackagingView Compare
XC7Z020-2CLG484I
Xilinx Inc.484-LFBGA, CSPBGA
484
130
256KB
1 V
DMA
BOTTOM
Tray
- XC7Z020-3CLG484EXilinx Inc.
484-LFBGA, CSPBGA
484
130
256KB
1 V
DMA
BOTTOM
Tray
XC7Z020-2CLG484I
VS
XC7Z020-3CLG484E
XC7Z020-1CLG400CXilinx Inc.400-LFBGA, CSPBGA
400
130
256KB
1 V
DMA
BOTTOM
Tray
XC7Z020-2CLG484I
VS
XC7Z020-1CLG400C
- XC7Z020-1CLG484CXilinx Inc.
484-LFBGA, CSPBGA
2
130
256KB
1 V
DMA
BOTTOM
Tray
XC7Z020-2CLG484I
VS
XC7Z020-1CLG484C
M2GL005-VFG400Microsemi Corporation400-LFBGA
400
169
87.9 kB
1.2 V
-
BOTTOM
Tray
XC7Z020-2CLG484I
VS
M2GL005-VFG400
ICHOME's Payment Terms
ICHOME offers many types of payment options, and support in multiple currencies such as RMB, US dollars, Rubles, etc. New customers can be offered COD or credit card. As relationships are built, payment plans can be established so that payments can be made on a predetermined time frame after receipt of the invoice.
T/T IN ADVANCE (Pay at time of order placement via wire transfer)
ESCROW (3rd party manages payment transfer)
PAYPAL(There is a 0,35 + 3,4% charge for using Paypal)
How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT, SF Express.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does ICHOME mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Xilinx's XC7Z020-2CLG484I price and stock displayed on the website accurate?
ICHOME inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with ICHOME salesperson or online customer service before payment.
You Also Ask
Need Any Service, please feel free contact us: sales@ichome.com
After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
