Xilinx Inc. XC7Z020-1CLG484C
XC7Z020-1CLG484C
In Stock:94131
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$84.340000
$84.340000
10
$79.570000
$795.700000
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Xilinx Inc. XC7Z020-1CLG484C information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Package / Case
484-LFBGA, CSPBGA
Surface Mount
YES
Number of Pins
2
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2009
Series
Zynq®-7000
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
484
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1V
Terminal Pitch
0.8mm
Frequency
667MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC7Z020
JESD-30 Code
S-PBGA-B484
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage
3.3V
Min Supply Voltage
1.2V
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-1
Primary Attributes
Artix™-7 FPGA, 85K Logic Cells
Height Seated (Max)
1.6mm
Length
19mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is used to build this SoC.Its package is 484-LFBGA, CSPBGA.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The system on a chip is part of the series Zynq?-7000.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.As one of the most important things to note is that this SoC security combines Artix?-7 FPGA, 85K Logic Cells together.An advanced Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V voltage rating should be utilized when using this system on chip SoC.system on a chip benefits from 484 terminations.XC7Z020 can help you find system on chips with similar specs and purposes.The wireless SoC works at a frequency of 667MHz.There is no doubt that the SoC meaning is based on the core architecture of ARM.The computer SoC is available in 2-pin form.Voltage of maximum supply is 3.3V.The SoC security receives at least 1.2V watts of power.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z020-1CLG484C System On Chip (SoC) applications.
- Body control module
- Smart appliances
- Microcontroller based SoC ( RISC-V, ARM)
- USB hard disk enclosure
- RISC-V
- High-end PLC
- Optical drive
- Temperature Sensors
- Flow Sensors
- Personal Computers
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of I/ORAM SizePeripheralsTerminal PositionPackagingTerminal PitchView Compare
XC7Z020-1CLG484C
Xilinx Inc.484-LFBGA, CSPBGA
2
130
256KB
DMA
BOTTOM
Tray
0.8 mm
- XC7Z020-3CLG484EXilinx Inc.
484-LFBGA, CSPBGA
484
130
256KB
DMA
BOTTOM
Tray
0.8 mm
XC7Z020-1CLG484C
VS
XC7Z020-3CLG484E
- XC7Z020-2CLG484IXilinx Inc.
484-LFBGA, CSPBGA
484
130
256KB
DMA
BOTTOM
Tray
0.8 mm
XC7Z020-1CLG484C
VS
XC7Z020-2CLG484I
XC7Z010-1CLG400CXilinx Inc.400-LFBGA, CSPBGA
400
130
256KB
DMA
BOTTOM
Tray
0.8 mm
XC7Z020-1CLG484C
VS
XC7Z010-1CLG400C
M2GL005-VFG400Microsemi Corporation400-LFBGA
400
169
87.9 kB
-
BOTTOM
Tray
0.8 mm
XC7Z020-1CLG484C
VS
M2GL005-VFG400
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
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