Xilinx Inc. XC7Z030-2FFG676I
XC7Z030-2FFG676I
In Stock:94131
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$75.640000
$75.640000
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$71.355000
$713.550000
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Xilinx Inc. XC7Z030-2FFG676I information
Type
Parameter
Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Package / Case
676-BBGA, FCBGA
Surface Mount
YES
Number of Pins
676
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2009
Series
Zynq®-7000
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Subcategory
Other uPs/uCs/Peripheral ICs
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
1V
Terminal Pitch
1mm
Frequency
800MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC7Z030
Pin Count
676
Operating Supply Voltage
1V
Supply Voltage-Max (Vsup)
1.05V
Power Supplies
11.8V
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Boundary Scan
YES
Speed Grade
-2
RAM (words)
256000
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB
UV Erasable
N
Height Seated (Max)
3.24mm
Length
27mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC is built.There is a 676-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.It is a member of the Zynq?-7000 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A key point to note is that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.Housed in the state-of-art Tray package.Total I/Os on this SoC part are 130.A 1V power supply should be used.The SoCs wireless is considered unreliable if the voltage exceeds 1.05V.There are 676 terminations in total and that really benefits system on a chip.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Other uPs/uCs/Peripheral ICs.In order to operate system on chip, you will need 11.8V power supplies.Searching XC7Z030 will bring up system on chips with similar specs and purposes.The wireless SoC works at a frequency of 800MHz.In this SoC meaning, ARM serves as the core architecture.This is the 676-pin version of the computer SoC.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z030-2FFG676I System On Chip (SoC) applications.
- RISC-V
- Central alarm system
- Keyboard
- POS Terminals
- Efficient hardware for inference of neural networks
- Transmitters
- Healthcare
- Mobile market
- POS Terminals
- Published Paper
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthInterfaceSupply VoltagePeripheralsTechnologyJESD-609 CodeView Compare
XC7Z030-2FFG676I
Xilinx Inc.676-BBGA, FCBGA
676
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
1 V
DMA
CMOS
e1
- XC7Z030-1FFG676IXilinx Inc.
676-BBGA, FCBGA
676
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
1 V
DMA
CMOS
e1
XC7Z030-2FFG676I
VS
XC7Z030-1FFG676I
MCIMX6D7CVT08ACNXP USA Inc.624-FBGA, FCBGA
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-
-
-
-
CMOS
e1
XC7Z030-2FFG676I
VS
MCIMX6D7CVT08AC
- XC7Z030-1FBG676CXilinx Inc.
676-BBGA, FCBGA
676
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
1 V
DMA
CMOS
e1
XC7Z030-2FFG676I
VS
XC7Z030-1FBG676C
- XC7Z030-1FFG676CXilinx Inc.
676-BBGA, FCBGA
676
32 b
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
1 V
DMA
CMOS
e1
XC7Z030-2FFG676I
VS
XC7Z030-1FFG676C
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