Texas Instruments TLV1117LV33DCYR
TLV1117LV33DCYR
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Texas Instruments TLV1117LV33DCYR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Mounting Type
Surface Mount
Package / Case
TO-261-4, TO-261AA
Surface Mount
YES
Number of Pins
4
Operating Temperature
-40°C~125°C
Packaging
Tape & Reel (TR)
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
4
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Subcategory
Other Regulators
Packing Method
TR
Max Power Dissipation
1.59W
Technology
CMOS
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Terminal Pitch
2.3mm
Base Part Number
TLV1117
Pin Count
4
Number of Outputs
1
Voltage - Input (Max)
5.5V
Output Voltage
3.3V
Output Type
Fixed
Max Output Current
1A
Output Configuration
Positive
Power Dissipation
1.59W
Quiescent Current
50μA
Accuracy
2 %
Max Output Voltage
3.3V
Output Voltage 1
3.3V
Number of Regulators
1
Min Input Voltage
2V
Protection Features
Over Current, Over Temperature
Current - Quiescent (Iq)
100μA
Voltage Dropout (Max)
1.3V @ 800mA
PSRR
75dB (120Hz)
Dropout Voltage
455mV
Dropout Voltage1-Nom
0.57V
Min Output Voltage
3.3V
Min Current Limit
1.1A
Nominal Output Voltage
3.3V
Output Voltage Accuracy
1.5 %
Height
1.8mm
Length
6.5mm
Width
3.5mm
Thickness
1.6mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Design/Specification :
- PCN Assembly/Origin :
TLV1117LV33DCYR Description
The TLV1117LV series of low-dropout (LDO) linear regulators is a low input voltage version of the popular TLV1117 voltage regulator. The TLV1117LV is an extremely low-power device that consumes 500 times lower quiescent current than traditional 1117 voltage regulators, making the device suitable for applications that mandate very low standby current. The TLV1117LV family of LDOs is also stable with 0 mA of load current; there is no minimum load requirement, making the device an ideal choice for applications where the regulator must power very small loads during standby in addition to large currents on the order of 1 A during normal operation. The TLV1117LV offers excellent line and load transient performance, resulting in very small magnitude undershoots and overshoots of output voltage when the load current requirement changes from less than 1 mA to more than 500 mA.
The device is internally compensated to be stable with 0-Ω equivalent series resistance (ESR) capacitors. These key advantages enable the use of cost-effective, small-size ceramic capacitors. Cost-effective capacitors that have higher bias voltages and temperature derating can also be used if desired. The TLV1117LV series is available in a SOT-223 package.
TLV1117LV33DCYR Features
1.5% Typical Accuracy
Stable With 0-mA Output Current
Low Dropout: 455 mV at 1 A for Vout = 3.3 V
High PSRR: 65 dB at 1 kHz
Minimum Ensured Current Limit: 1.1 A
Stable With Cost-Effective Ceramic Capacitors: With 0-Ω ESR
Temperature Range: - 40 °C to 125 °C
Thermal Shutdown and Overcurrent Protection
ROHS3 Compliant
No SVHC
Lead Free
TLV1117LV33DCYR Applications
Set Top Boxes
TVs and Monitors
PC Peripherals, Notebooks, Motherboards
Modems and Other Communication Products
Switching Power Supply Post-Regulation
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of OutputsMax Output CurrentMin Input VoltageVoltage - Input (Max)Min Output VoltageNominal Output VoltageOutput VoltageMax Output VoltageAccuracyView Compare
TLV1117LV33DCYR
Texas InstrumentsTO-261-4, TO-261AA
4
1
1 A
2 V
5.5V
3.3 V
3.3 V
3.3 V
3.3 V
2 %
- TLV117118DCYTTexas Instruments
TO-261-4, TO-261AA
4
1
1 A
2 V
5.5V
-
1.8 V
1.8 V
-
2 %
TLV1117LV33DCYR
VS
TLV117118DCYT
- TLV117112DCYTTexas Instruments
TO-261-4, TO-261AA
4
1
1 A
2 V
5.5V
-
1.2 V
1.2 V
-
2 %
TLV1117LV33DCYR
VS
TLV117112DCYT
- TLV117125DCYTTexas Instruments
TO-261-4, TO-261AA
4
1
1 A
2 V
5.5V
2.5 V
2.5 V
2.5 V
2.5 V
1.5 %
TLV1117LV33DCYR
VS
TLV117125DCYT
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We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT, SF Express.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
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The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does ICHOME mainly purchase electronic components from?
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2.Are the Texas Instruments Incorporated (TI)'s TLV1117LV33DCYR price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
