Texas Instruments SN65HVD230DR
SN65HVD230DR
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Texas Instruments SN65HVD230DR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Contact Plating
Gold
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Surface Mount
YES
Number of Pins
8
Weight
72.603129mg
Operating Temperature
-40°C~85°C
Packaging
Cut Tape (CT)
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
Termination
SMD/SMT
ECCN Code
EAR99
Type
Transceiver
Subcategory
Network Interfaces
Technology
BICMOS
Voltage - Supply
3V~3.6V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3.3V
Base Part Number
65HVD230
Pin Count
8
Operating Supply Voltage
3.3V
Number of I/O
2
Nominal Supply Current
17mA
Max Supply Current
17mA
Slew Rate
15 V/μs
Data Rate
1Mbps
Protocol
CANbus
Number of Drivers/Receivers
1/1
Duplex
Half
Receiver Hysteresis
100mV
Number of Receivers
1
Height
1.75mm
Length
4.9mm
Width
3.91mm
Thickness
1.58mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Design/Specification :
- Datasheets :
SN65HVD230DR Overview
An excellent driver IC for common LEDs thanks to its enhanced 8-SOIC (0.154, 3.90mm Width) package.The package of this receiver is Cut Tape (CT).Since this part is a Transceiver can transceiver, a number of solutions have been able to utiliTransceivere it for various purposes.The wide receiver can be mounted on any Surface Mount-type PCB or development board.This differential driver requires a 3V~3.6V power supply.There can be up to 1/1 eligible receivers/drivers on the field at the same time with this electronic part.As its name implies, this ic receiver is designed for applications where -40°C~85°C is the operating temperature.Driver ICs in this category can operate efficiently with a supply voltage range of 3.3V.Wide receiver has 8 terminations built in for driving or receiving signals from data.There are 8 pinouts available on this transceiver which are market standard.Since the part number 65HVD230 represents the product type, temperature, package, etc., you can try searching with that number to find more variants.An enhanced power dissipation control driver IC featuring 8 pins.This transceiver module is designed to operate from an input voltage supply of 3.3V.In this category, this rf transceiver module belongs to the Network Interfaces subcategory.In addition to that, it contains 1 receivers as well.A can transceiver that has a current input of 17mA or greater may be affected by malfunctions.There are 2 serial I/Os on board this IC, and it has a standard VGA interface.
SN65HVD230DR Features
Cut Tape (CT) package
8 pin count
8 pins
SN65HVD230DR Applications
There are a lot of Texas Instruments SN65HVD230DR Drivers/Receivers/Transceivers applications.
- Wired telephone
- Carrier phase observations
- Thermal management
- Indoor ad hoc meeting
- Fiber optic cable connection network
- Wireless security systems
- Desktop radio
- Home theater wiring-free
- WDM transmission
- Metro access rings
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of ReceiversData RateSupply VoltageNumber of Drivers/ReceiversMoisture Sensitivity Level (MSL)WidthView Compare
SN65HVD230DR
NA8-SOIC (0.154, 3.90mm Width)
8
1
1Mbps
3.3 V
1/1
1 (Unlimited)
3.91 mm
- SN65HVD72DRNA
8-SOIC (0.154, 3.90mm Width)
8
-
250kbps
3.3 V
1/1
1 (Unlimited)
3.91 mm
SN65HVD230DR
VS
SN65HVD72DR
- SN65HVD75DRNA
8-SOIC (0.154, 3.90mm Width)
8
-
20Mbps
3.3 V
1/1
1 (Unlimited)
3.91 mm
SN65HVD230DR
VS
SN65HVD75DR
- SN65HVD78DRNA
8-SOIC (0.154, 3.90mm Width)
8
-
50Mbps
3.3 V
1/1
1 (Unlimited)
3.91 mm
SN65HVD230DR
VS
SN65HVD78DR
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2.Are the Texas Instruments Incorporated (TI)'s SN65HVD230DR price and stock displayed on the website accurate?
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
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Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
