ON Semiconductor NDC7001C
NDC7001C
In Stock:94131
Qty
Unit Price
Ext Price
1
$0.840000
$0.840000
10
$0.792000
$7.920000
100
$0.747100
$74.710000
500
$0.704800
$352.400000
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ON Semiconductor NDC7001C information
Type
Parameter
Factory Lead Time
8 Weeks
Lifecycle Status
ACTIVE (Last Updated: 3 days ago)
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
SOT-23-6 Thin, TSOT-23-6
Number of Pins
6
Weight
36mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2002
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
6
ECCN Code
EAR99
Resistance
2Ohm
Subcategory
Other Transistors
Max Power Dissipation
700mW
Terminal Form
GULL WING
Current Rating
350mA
Number of Elements
2
Number of Channels
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
960mW
Turn On Delay Time
2.8 ns
FET Type
N and P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
2 Ω @ 510mA, 10V
Vgs(th) (Max) @ Id
2.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
20pF @ 25V
Current - Continuous Drain (Id) @ 25°C
510mA 340mA
Gate Charge (Qg) (Max) @ Vgs
1.5nC @ 10V
Rise Time
10ns
Polarity/Channel Type
N-CHANNEL AND P-CHANNEL
Fall Time (Typ)
10 ns
Turn-Off Delay Time
8 ns
Continuous Drain Current (ID)
510mA
Threshold Voltage
2.1V
Gate to Source Voltage (Vgs)
20V
Drain Current-Max (Abs) (ID)
0.51A
Drain to Source Breakdown Voltage
60V
Dual Supply Voltage
60V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj)
150°C
FET Feature
Logic Level Gate
Nominal Vgs
2.1 V
Min Breakdown Voltage
60V
Height
900μm
Length
3mm
Width
1.7mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Packaging :
- TechnicalDrawing :
- ReachStatement :
The NDC7001C is a dual N and P-Channel Enhancement Mode Field Effect Transistor made with ON Semiconductor's unique DMOS technology. This high-density method was created to reduce on-state resistance, provide durable and reliable performance, and allow for quick switching. Low voltage, low current, switching, and power supply applications are ideal for the NDC7001C transistor.
NDC7001C Features
Q1:
0.51 A, 60 V
RDS(ON) = 2 Ω @ VGS = 10 V
RDS(ON) = 4 Ω @ VGS = 4.5 V
Q2:
-0.34 A, 60 V
RDS(ON) = 5 Ω @ VGS = -10 V
RDS(ON) = 7.5 Ω @ VGS = -4.5 V
High density cell design for low RDS (ON)
Design using copper lead-frame for superior thermal and electrical capabilities
NDC7001C Applications
Industrial
Power Management
Automotive
Vehicle Electrification
ADAS
Powertrain, Safety and Security
Body Electronics and LED Lighting
Technology
- ImagePart NumberManufacturerMountPackage / CaseContinuous Drain Current (ID)Current - Continuous Drain (Id) @ 25°CThreshold VoltageGate to Source Voltage (Vgs)Max Power DissipationPower DissipationView Compare
NDC7001C
ON SemiconductorSurface Mount
SOT-23-6 Thin, TSOT-23-6
510 mA
510mA, 340mA
2.1 V
20 V
700 mW
960 mW
- NDC7002NON Semiconductor
Surface Mount
SOT-23-6 Thin, TSOT-23-6
510 mA
-
1.9 V
20 V
700 mW
960 mW
NDC7001C
VS
NDC7002N
DMN61D8LVTQ-7Diodes IncorporatedSurface Mount
SOT-23-6 Thin, TSOT-23-6
630 mA
-
-
-
820 mW
-
NDC7001C
VS
DMN61D8LVTQ-7
- DMN61D8LVT-7Diodes Incorporated
Surface Mount
SOT-23-6 Thin, TSOT-23-6
630 mA
-
-
-
820 mW
-
NDC7001C
VS
DMN61D8LVT-7
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
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2.Are the ON Semiconductor's NDC7001C price and stock displayed on the website accurate?
ICHOME inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with ICHOME salesperson or online customer service before payment.
You Also Ask
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
