ON Semiconductor FDS4897C
FDS4897C
In Stock:94131
Qty
Unit Price
Ext Price
1
$16.400000
$16.400000
10
$15.472000
$154.720000
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ON Semiconductor FDS4897C information
Type
Parameter
Factory Lead Time
12 Weeks
Lifecycle Status
ACTIVE (Last Updated: 1 day ago)
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Weight
187mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2005
Series
PowerTrench®
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Resistance
29MOhm
Subcategory
Other Transistors
Max Power Dissipation
900mW
Terminal Position
DUAL
Terminal Form
GULL WING
Number of Elements
2
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2W
FET Type
N and P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
29m Ω @ 6.2A, 10V
Vgs(th) (Max) @ Id
3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
760pF @ 20V
Current - Continuous Drain (Id) @ 25°C
6.2A 4.4A
Gate Charge (Qg) (Max) @ Vgs
20nC @ 10V
Rise Time
15ns
Polarity/Channel Type
N-CHANNEL AND P-CHANNEL
Fall Time (Typ)
18 ns
Turn-Off Delay Time
45 ns
Continuous Drain Current (ID)
4.4A
Threshold Voltage
1.9V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
40V
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Logic Level Gate
Height
1.5mm
Length
5mm
Width
4mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- TechnicalDrawing :
- ReachStatement :
FDS4897C Description
These dual N-channel and P-channel enhanced mode power field effect transistors are produced using advanced Power Tritch manufacturing processes that are customized to minimize on-resistance while maintaining excellent switching performance.
FDS4897C Features
Q1 N-Channel
6.2A, 40V
Max. RDS(on) = 29 mΩ at VGS = 10 V
Max. RDS(on) = 36 mΩ at VGS = 4.5 V
Q2 P-Channel
-4.4A, -40V
Max. RDS(on) = 46 mΩ at VGS = -10 V
Max. RDS(on) = 63 mΩ at VGS = -4.5 V
High power and handling capability in a widelyused surface mount package
RoHS compliant
FDS4897C Applications
This product is general usage and suitable for many different applications.
Inverter
Power Supplies
- ImagePart NumberManufacturerMountPackage / CaseContinuous Drain Current (ID)Current - Continuous Drain (Id) @ 25°CThreshold VoltageGate to Source Voltage (Vgs)Max Power DissipationPower DissipationView Compare
FDS4897C
ON SemiconductorSurface Mount
8-SOIC (0.154, 3.90mm Width)
4.4 A
6.2A, 4.4A
1.9 V
20 V
900 mW
2 W
- FDS8958BON Semiconductor
Surface Mount
8-SOIC (0.154, 3.90mm Width)
4.5 A
6.4A, 4.5A
2 V
25 V
900 mW
1.6 W
FDS4897C
VS
FDS8958B
- FDS4897ACON Semiconductor
Surface Mount
8-SOIC (0.154, 3.90mm Width)
5.2 A
6.1A, 5.2A
2 V
20 V
900 mW
2 W
FDS4897C
VS
FDS4897AC
- FDS8958AON Semiconductor
Surface Mount
8-SOIC (0.154, 3.90mm Width)
7 A
7A, 5A
1.9 V
20 V
2 W
2 W
FDS4897C
VS
FDS8958A
IRF9389TRPBFInfineon TechnologiesSurface Mount
8-SOIC (0.154, 3.90mm Width)
4.6 A
6.8A, 4.6A
1.8 V
20 V
2 W
2 W
FDS4897C
VS
IRF9389TRPBF
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1. Understand the shipping rules of the destination country
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If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
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2.Are the ON Semiconductor's FDS4897C price and stock displayed on the website accurate?
ICHOME inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with ICHOME salesperson or online customer service before payment.
You Also Ask
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
