ON Semiconductor FDD8424H
FDD8424H
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ON Semiconductor FDD8424H information
Type
Parameter
Factory Lead Time
17 Weeks
Lifecycle Status
ACTIVE (Last Updated: 1 day ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
TO-252-5, DPak (4 Leads + Tab), TO-252AD
Number of Pins
5
Weight
260.37mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2014
Series
PowerTrench®
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
4
ECCN Code
EAR99
Resistance
24MOhm
Terminal Finish
Tin (Sn)
Subcategory
Other Transistors
Max Power Dissipation
3.1W
Terminal Position
SINGLE
Terminal Form
GULL WING
Base Part Number
FDD8424
JESD-30 Code
R-PSSO-G4
Number of Elements
2
Number of Channels
2
Operating Mode
ENHANCEMENT MODE
Power Dissipation
3.1W
Case Connection
DRAIN
Turn On Delay Time
7 ns
Power - Max
1.3W
FET Type
N and P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
24m Ω @ 9A, 10V
Vgs(th) (Max) @ Id
3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
1000pF @ 20V
Current - Continuous Drain (Id) @ 25°C
9A 6.5A
Gate Charge (Qg) (Max) @ Vgs
20nC @ 10V
Rise Time
3ns
Polarity/Channel Type
N-CHANNEL AND P-CHANNEL
Fall Time (Typ)
3 ns
Turn-Off Delay Time
20 ns
Continuous Drain Current (ID)
9A
Threshold Voltage
1.7V
Gate to Source Voltage (Vgs)
20V
Drain Current-Max (Abs) (ID)
9A
Drain to Source Breakdown Voltage
40V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj)
150°C
FET Feature
Logic Level Gate
Height
2.517mm
Length
6.73mm
Width
6.22mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Packaging :
Description
Designed specifically to reduce on-state resistance and maintain a low gate charge for the best switching performance, the FDD8424H is a 40V Dual N-channel and P-channel PowerTrench? MOSFET. The most recent medium voltage power MOSFET is an optimized power switch that combines a soft reverse recovery body diode, a tiny gate charge (QG), and a small reverse recovery charge (Qrr) to enable quick switching for synchronous rectification in AC/DC power supply. It makes use of a shielded-gate design that maintains charge balance. These devices' FOM (figure of merit (QGxRDS(ON)) is 66 percent lower than that of the preceding generation because to the use of this cutting-edge technology. As a result of its ability to reduce unfavorable voltage spikes in synchronous rectification, the new PowerTrench? MOSFET can replace higher voltage rating MOSFETs or do away with snubber circuits altogether. This product is all-purpose and appropriate for a wide range of uses.
Features
N-Channel: 40V, 20A, 24mΩ
P-Channel: -40V, -20A, 54mΩ
Q1: N-Channel
Max. RDS(on) = 24mΩ at VGS = 10V, ID = 9.0A
Max. RDS(on) = 30mΩ at VGS = 4.5V, ID = 7.0A
Q2: P-Channel
Max. RDS(on) = 54mΩ at VGS = -10V, ID = -6.5A
Max. RDS(on) = 70mΩ at VGS = -4.5V, ID = -5.6A
Fast switching speed
RoHS Compliant
Applications
Inverter
H-Bridge
Small motor control
Solar inverters
Automotive applications
- ImagePart NumberManufacturerMountPackage / CaseContinuous Drain Current (ID)Current - Continuous Drain (Id) @ 25°CThreshold VoltageGate to Source Voltage (Vgs)Max Power DissipationPower DissipationView Compare
FDD8424H
ON SemiconductorSurface Mount
TO-252-5, DPak (4 Leads + Tab), TO-252AD
9 A
9A, 6.5A
1.7 V
20 V
3.1 W
3.1 W
FDD8451ON SemiconductorSurface Mount
TO-252-3, DPak (2 Leads + Tab), SC-63
28 A
9A (Ta), 28A (Tc)
2.1 V
20 V
-
30 W
FDD8424H
VS
FDD8451
- FDD6612AON Semiconductor
Surface Mount
TO-252-3, DPak (2 Leads + Tab), SC-63
30 A
9.5A (Ta), 30A (Tc)
2 V
20 V
-
36 W
FDD8424H
VS
FDD6612A
STD30NF03LT4STMicroelectronicsSurface Mount
TO-252-3, DPak (2 Leads + Tab), SC-63
30 A
30A (Tc)
1.7 V
20 V
-
50 W
FDD8424H
VS
STD30NF03LT4
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2.Are the ON Semiconductor's FDD8424H price and stock displayed on the website accurate?
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
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