ON Semiconductor FDS4935BZ
FDS4935BZ
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ON Semiconductor FDS4935BZ information
Type
Parameter
Factory Lead Time
10 Weeks
Lifecycle Status
ACTIVE (Last Updated: 1 day ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Weight
187mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2006
Series
PowerTrench®
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
Termination
SMD/SMT
ECCN Code
EAR99
Resistance
22MOhm
Terminal Finish
Tin (Sn)
Additional Feature
ESD PROTECTION
Subcategory
Other Transistors
Voltage - Rated DC
-30V
Max Power Dissipation
1.6W
Terminal Form
GULL WING
Current Rating
-6.9A
Number of Elements
2
Number of Channels
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
1.6W
Turn On Delay Time
12 ns
Power - Max
900mW
FET Type
2 P-Channel (Dual)
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
22m Ω @ 6.9A, 10V
Vgs(th) (Max) @ Id
3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
1360pF @ 15V
Current - Continuous Drain (Id) @ 25°C
6.9A
Gate Charge (Qg) (Max) @ Vgs
40nC @ 10V
Rise Time
13ns
Drain to Source Voltage (Vdss)
30V
Fall Time (Typ)
13 ns
Turn-Off Delay Time
68 ns
Continuous Drain Current (ID)
-6.9A
Threshold Voltage
-1.9V
Gate to Source Voltage (Vgs)
25V
Drain to Source Breakdown Voltage
-30V
Dual Supply Voltage
-30V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj)
150°C
FET Feature
Logic Level Gate
Nominal Vgs
1.9 V
Height
1.75mm
Length
5mm
Width
4mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- ReachStatement :
FDS4935BZ Description
This P-channel MOSFET is designed to improve the overall efficiency of the DC/DC converter using synchronous or conventional switch PWM controllers and battery chargers.These MOSFET have faster switching speed and lower gate charge than other MOSFET with similar RDS specification.The result is an easy-to-drive and safer MOSFET (even at very high frequencies) and a DC/DC power design with higher overall efficiency.
FDS4935BZ Features
¨C6.9 A, ¨C30 V
RDS(ON) = 22 m|? @ VGS = ¨C10 V
RDS(ON) = 35 m @ VGS = ¨C 4.5 V
Extended VGSS range (¨C25V) for battery applications
ESD protection diode (note 3)
High performance trench technology for extremelylow RDS(ON)
High power and current handling capability
FDS4935BZ Applications
This product is general usage and suitable for many different applications.
- ImagePart NumberManufacturerMountPackage / CaseDrain to Source Voltage (Vdss)Continuous Drain Current (ID)Current - Continuous Drain (Id) @ 25°CThreshold VoltageGate to Source Voltage (Vgs)Max Power DissipationView Compare
FDS4935BZ
ON SemiconductorSurface Mount
8-SOIC (0.154, 3.90mm Width)
30V
-6.9 A
6.9A
-1.9 V
25 V
1.6 W
- FDS6990AON Semiconductor
Surface Mount
8-SOIC (0.154, 3.90mm Width)
-
7.5 A
-
1.9 V
20 V
900 mW
FDS4935BZ
VS
FDS6990A
DMG4800LSD-13Diodes IncorporatedSurface Mount
8-SOIC (0.154, 3.90mm Width)
30V
7.5 A
-
1.6 V
25 V
1.17 W
FDS4935BZ
VS
DMG4800LSD-13
- FDS8858CZON Semiconductor
Surface Mount
8-SOIC (0.154, 3.90mm Width)
-
8.6 A
8.6A, 7.3A
1.6 V
25 V
900 mW
FDS4935BZ
VS
FDS8858CZ
- FDS8978ON Semiconductor
Surface Mount
8-SOIC (0.154, 3.90mm Width)
30V
7.5 A
-
2.5 V
20 V
1.6 W
FDS4935BZ
VS
FDS8978
ICHOME's Payment Terms
ICHOME offers many types of payment options, and support in multiple currencies such as RMB, US dollars, Rubles, etc. New customers can be offered COD or credit card. As relationships are built, payment plans can be established so that payments can be made on a predetermined time frame after receipt of the invoice.
T/T IN ADVANCE (Pay at time of order placement via wire transfer)
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PAYPAL(There is a 0,35 + 3,4% charge for using Paypal)
How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT, SF Express.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does ICHOME mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the ON Semiconductor's FDS4935BZ price and stock displayed on the website accurate?
ICHOME inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with ICHOME salesperson or online customer service before payment.
You Also Ask
Need Any Service, please feel free contact us: sales@ichome.com
After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
