Infineon Technologies IRF7509TRPBF
IRF7509TRPBF
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Infineon Technologies IRF7509TRPBF information
Type
Parameter
Factory Lead Time
12 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
1998
Series
HEXFET®
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
Resistance
200mOhm
Additional Feature
ULTRA LOW RESISTANCE
Max Power Dissipation
1.25W
Terminal Form
GULL WING
Current Rating
2.7A
Base Part Number
IRF7509PBF
Number of Elements
2
Number of Channels
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
1.25W
FET Type
N and P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
110m Ω @ 1.7A, 10V
Vgs(th) (Max) @ Id
1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
210pF @ 25V
Current - Continuous Drain (Id) @ 25°C
2.7A 2A
Gate Charge (Qg) (Max) @ Vgs
12nC @ 10V
Rise Time
12ns
Polarity/Channel Type
N-CHANNEL AND P-CHANNEL
Fall Time (Typ)
9.3 ns
Turn-Off Delay Time
19 ns
Continuous Drain Current (ID)
2.7A
Threshold Voltage
1V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
30V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj)
150°C
FET Feature
Logic Level Gate
Nominal Vgs
1 V
Height
1.11mm
Length
3.048mm
Width
3.048mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Other Related Documents :
- PCN Design/Specification :
- PCN Packaging :
- ConflictMineralStatement :
IRF7509TRPBF Description
The fifth generation HEXFET of International Rectifier Company adopts advanced technology to achieve extremely low on-resistance per silicon area. This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, provides designers with an extremely efficient and reliable device for use in a variety of applications. The new Micro8 package covers only half the footprint of the standard SO-8, making it the smallest footprint available in the SOIC outline. This makes Micro8 an ideal device for applications with limited space on printed circuit boards. The ultra-thin shape of Micro8 (< 1.1 mm) makes it easy to adapt to extremely thin application environments, such as portable electronics and PCMCIA cards.
IRF7509TRPBF Features
Generation V Technology
Ultra Low On-Resistance
Dual N and P Channel MOSFET
Very Small SOIC Package
Low Profile (<1.1mm)
Available in Tape & Reel
Fast Switching
Lead-Free
IRF7509TRPBF Applications
provides designers with an extremely efficient and reliable device for use in a variety of applications.
- ImagePart NumberManufacturerMountPackage / CaseContinuous Drain Current (ID)Current - Continuous Drain (Id) @ 25°CThreshold VoltageGate to Source Voltage (Vgs)Max Power DissipationPower DissipationView Compare
IRF7509TRPBF
Infineon TechnologiesSurface Mount
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
2.7 A
2.7A, 2A
1 V
20 V
1.25 W
1.25 W
- IRF7606TRPBFInfineon Technologies
Surface Mount
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
-3.6 A
3.6A (Ta)
-
20 V
-
1.8 W
IRF7509TRPBF
VS
IRF7606TRPBF
- IRF7506TRPBFInfineon Technologies
Surface Mount
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
-1.7 A
1.7A
-1 V
20 V
1.25 W
1.25 W
IRF7509TRPBF
VS
IRF7506TRPBF
- IRF7503TRPBFInfineon Technologies
Surface Mount
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
2.4 A
-
1 V
20 V
1.25 W
1.25 W
IRF7509TRPBF
VS
IRF7503TRPBF
ZXMD63P02XTADiodes IncorporatedSurface Mount
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
1.7 A
-
-
12 V
1.04 W
1.25 W
IRF7509TRPBF
VS
ZXMD63P02XTA
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How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT, SF Express.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does ICHOME mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Infineon Technologies's IRF7509TRPBF price and stock displayed on the website accurate?
ICHOME inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with ICHOME salesperson or online customer service before payment.
You Also Ask
Need Any Service, please feel free contact us: sales@ichome.com
After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
