Microchip Technology TC4425CPA
TC4425CPA
In Stock:94131
Qty
Unit Price
Ext Price
1
$2.730000
$2.730000
10
$2.577000
$25.770000
100
$2.430900
$243.090000
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Microchip Technology TC4425CPA information
Type
Parameter
Factory Lead Time
7 Weeks
Mount
Through Hole
Mounting Type
Through Hole
Package / Case
8-DIP (0.300, 7.62mm)
Number of Pins
8
Operating Temperature
0°C~150°C TJ
Packaging
Tube
Published
2003
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Subcategory
MOSFET Drivers
Max Power Dissipation
730mW
Technology
CMOS
Voltage - Supply
4.5V~18V
Terminal Position
DUAL
Number of Functions
2
Base Part Number
TC4425
Pin Count
8
Number of Outputs
2
Max Output Current
3A
Nominal Supply Current
2.5mA
Power Dissipation
730mW
Max Supply Current
2.5mA
Propagation Delay
75 ns
Input Type
Inverting, Non-Inverting
Turn On Delay Time
75 ns
Rise Time
35ns
Fall Time (Typ)
35 ns
Rise / Fall Time (Typ)
23ns 25ns
Interface IC Type
BUFFER OR INVERTER BASED MOSFET DRIVER
Channel Type
Independent
Turn On Time
0.1 μs
Output Peak Current Limit-Nom
3A
Driven Configuration
Low-Side
Gate Type
N-Channel, P-Channel MOSFET
Current - Peak Output (Source, Sink)
3A 3A
High Side Driver
YES
Logic Voltage - VIL, VIH
0.8V 2.4V
Turn Off Time
0.1 μs
Height
4.06mm
Length
10.16mm
Width
6.6mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
TC4425CPA Overview
In order to increase flexibility, the package 8-DIP (0.300, 7.62mm) is used.A packaging method of Tube is indicated.Through Hole is mounted in the way.Gate drivers can demonstrate Gate driverss superiorGate driversy wGate driversh a 4.5V~18V supply voltage.This gate type has a N-Channel, P-Channel MOSFET design.This device allows temperatures in the range of 0°C~150°C TJ.Inverting, Non-Inverting is used as the input type in this program.As a result of its configuration, it contains a maximum of 8 terminations.Under its base part number TC4425, various related parts can be found.Mosfet driver is mounted using the Through Hole method.When the device is designed, it has 8 pins.Its interface IC is BUFFER OR INVERTER BASED MOSFET DRIVER.An output current as high as 3A can be achieved at maximum power.Its subcategory of MOSFET Drivers contains various useful electronic components.The component has 8 pins.The basis of the model has 2 outputs integrated.Based on its maximum power dissipation of 730mW, it is clear that it is capable of transferring and conducting power loss without overheating.Mosfet gate drivers is recommended to keep the supply current at 2.5mA to ensure greater stabilMosfet gate driversy.
TC4425CPA Features
Embedded in the Tube package
Employing a gate type of N-Channel, P-Channel MOSFET
8 pins
Maximum power dissipation of 730mW
TC4425CPA Applications
There are a lot of Microchip Technology TC4425CPA gate drivers applications.
- Portable Navigation Devices
- PCMCIA applications
- High power buffers
- High-voltage isolated DC-DC converters
- Broadcast equipment
- Solar power supplies
- serial peripheral interface (SPI), I2C
- Motor controllers
- Motor Drives
- A/D drivers
- ImagePart NumberManufacturerPackage / CaseNumber of PinsChannel TypeMax Output CurrentRise TimeMax Power DissipationPower DissipationVoltage - SupplyView Compare
TC4425CPA
Microchip Technology8-DIP (0.300, 7.62mm)
8
Independent
3 A
35 ns
730 mW
730 mW
4.5V ~ 18V
- TC4423CPAMicrochip Technology
8-DIP (0.300, 7.62mm)
8
Independent
3 A
35 ns
730 mW
730 mW
4.5V ~ 18V
TC4425CPA
VS
TC4423CPA
- TC4424EPAMicrochip Technology
8-DIP (0.300, 7.62mm)
8
Independent
3 A
35 ns
730 mW
730 mW
4.5V ~ 18V
TC4425CPA
VS
TC4424EPA
- TC4424CPAMicrochip Technology
8-DIP (0.300, 7.62mm)
8
Independent
3 A
35 ns
730 mW
730 mW
4.5V ~ 18V
TC4425CPA
VS
TC4424CPA
- MIC4424CNMicrochip Technology
8-DIP (0.300, 7.62mm)
-
Independent
-
-
-
-
4.5V ~ 18V
TC4425CPA
VS
MIC4424CN
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
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