Infineon Technologies IR2113PBF
IR2113PBF
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Infineon Technologies IR2113PBF information
Type
Parameter
Factory Lead Time
12 Weeks
Mount
Surface Mount, Through Hole
Mounting Type
Through Hole
Package / Case
14-DIP (0.300, 7.62mm)
Number of Pins
14
Operating Temperature
-40°C~150°C TJ
Packaging
Tube
Published
1996
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
14
Termination
SMD/SMT
ECCN Code
EAR99
Type
Integrated Circuit (IC)
Subcategory
MOSFET Drivers
Max Power Dissipation
1.25W
Technology
CMOS
Voltage - Supply
3.3V~20V
Terminal Position
DUAL
Number of Functions
1
Supply Voltage
15V
Base Part Number
IR2113PBF
Number of Outputs
2
Output Voltage
20V
Max Output Current
2A
Operating Supply Voltage
15V
Nominal Supply Current
340μA
Power Dissipation
1.25W
Output Current
2.5A
Max Supply Current
340μA
Propagation Delay
150 ns
Input Type
Non-Inverting
Turn On Delay Time
20 ns
Max Output Voltage
20V
Reference Voltage
600V
Rise Time
35ns
Fall Time (Typ)
25 ns
Turn-Off Delay Time
20 ns
Min Output Voltage
10V
Rise / Fall Time (Typ)
25ns 17ns
Channel Type
Independent
Turn On Time
0.15 μs
Output Peak Current Limit-Nom
2.5A
Driven Configuration
Half-Bridge
Gate Type
IGBT, N-Channel MOSFET
Current - Peak Output (Source, Sink)
2A 2A
High Side Driver
YES
Logic Voltage - VIL, VIH
6V 9.5V
Height
2.35mm
Length
10.4902mm
Width
7.11mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead, Lead Free
- Datasheets :
- Other Related Documents :
infineontechnologies-tda5200xuma1-otherrelateddocuments-8656.pdf
- PCN Packaging :
- ConflictMineralStatement :
IR2113PBF Overview
The 14-DIP (0.300, 7.62mm) package provides greater flexibility.A packaging method of Tube is used.Ideally, it should be mounted in the direction of Through Hole.When the supply voltage is set to 3.3V~20V, it can demonstrate its superiority.A gate type of IGBT, N-Channel MOSFET has been used in its design.This device is allowed to operate in a temperature range of -40°C~150°C TJ.The input type is Non-Inverting.It's configured with 14 terminations.Numerous related parts are available for its base part number IR2113PBF.Mosfet driver is mounted using Surface Mount, Through Hole.At the time of design, it is configured with 14 pins.In addition, it is specifically designed to operate with a supply voltage of 15V.There is a maximum output current of 2A.In this subcategory of MOSFET Drivers, there are numerous useful electronic components.The basis of this model has 2 outputs integrated.Mosfet gate drivers supports a current output of 2.5A.Its maximum power dissipation of 1.25W also demonstrates its maximum ability to transfer power without overheating.Keeping the supply current at 340μA ensures greater stability.A voltage of 20V is output by this device.During the operation of the system, the voltage of the operating supply should be set to 15V.Mosfet driver ic is recommended to keep the maximum output voltage at 20V.
IR2113PBF Features
Embedded in the Tube package
Employing a gate type of IGBT, N-Channel MOSFET
14 pins
Maximum power dissipation of 1.25W
IR2113PBF Applications
There are a lot of Infineon Technologies IR2113PBF gate drivers applications.
- Motor controllers
- serial peripheral interface (SPI), I2C
- Industrial motor drives - compact, standard, premium, servo drives
- White Goods - Air Conditioner, Washing Machine,
- High-voltage isolated DC-DC converters
- Active filtering
- Pulse transformer drivers
- Commercial air-conditioning (CAC)
- Isolated Supplies for controller area network (CAN),
- 48 V to 12 V PoL Converters, 48 V to Low Voltage Bus Converter,
- ImagePart NumberManufacturerPackage / CaseNumber of PinsChannel TypeMax Output CurrentOutput CurrentRise TimeSupply VoltageMax Power DissipationView Compare
IR2113PBF
Infineon Technologies14-DIP (0.300, 7.62mm)
14
Independent
2 A
2.5 A
35 ns
15 V
1.25 W
- MIC4469YNMicrochip Technology
14-DIP (0.300, 7.62mm)
14
Independent
1.2 A
1.2 A
25 ns
-
1.5 W
IR2113PBF
VS
MIC4469YN
- FAN7392NON Semiconductor
14-DIP (0.300, 7.62mm)
14
Independent
3 A
3 A
25 ns
15 V
1.6 W
IR2113PBF
VS
FAN7392N
- MIC4467ZNMicrochip Technology
14-DIP (0.300, 7.62mm)
14
Independent
1.2 A
1.2 A
25 ns
-
1.5 W
IR2113PBF
VS
MIC4467ZN
- MIC4469BNMicrochip Technology
14-DIP (0.300, 7.62mm)
-
Independent
-
-
-
-
-
IR2113PBF
VS
MIC4469BN
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does ICHOME mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Infineon Technologies's IR2113PBF price and stock displayed on the website accurate?
ICHOME inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with ICHOME salesperson or online customer service before payment.
You Also Ask
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
