Infineon Technologies IR2110PBF
IR2110PBF
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Infineon Technologies IR2110PBF information
Type
Parameter
Factory Lead Time
26 Weeks
Mount
Through Hole
Mounting Type
Through Hole
Package / Case
14-DIP (0.300, 7.62mm)
Number of Pins
14
Weight
1.620005g
Operating Temperature
-40°C~150°C TJ
Packaging
Tube
Published
1996
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
14
Termination
Through Hole
ECCN Code
EAR99
Type
Integrated Circuit (IC)
Terminal Finish
Matte Tin (Sn)
Subcategory
MOSFET Drivers
Max Power Dissipation
1.6W
Technology
CMOS
Voltage - Supply
3.3V~20V
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
250
Number of Functions
1
Supply Voltage
15V
Reflow Temperature-Max (s)
30
Base Part Number
IR2110PBF
Number of Outputs
2
Output Voltage
20V
Max Output Current
2A
Operating Supply Voltage
15V
Operating Supply Current
340μA
Power Dissipation
1.6W
Output Current
2.5A
Max Supply Current
340μA
Propagation Delay
150 ns
Input Type
Non-Inverting
Turn On Delay Time
10 ns
Max Output Voltage
20V
Rise Time
35ns
Fall Time (Typ)
25 ns
Turn-Off Delay Time
10 ns
Min Output Voltage
10V
Rise / Fall Time (Typ)
25ns 17ns
Channel Type
Independent
Turn On Time
0.15 μs
Output Peak Current Limit-Nom
2.5A
Driven Configuration
Half-Bridge
Gate Type
IGBT, N-Channel MOSFET
Current - Peak Output (Source, Sink)
2A 2A
High Side Driver
YES
Logic Voltage - VIL, VIH
6V 9.5V
High Side Voltage - Max (Bootstrap)
500V
Height
4.9276mm
Length
20.1676mm
Width
7.11mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead, Lead Free
- Datasheets :
- Other Related Documents :
infineontechnologies-tda5200xuma1-otherrelateddocuments-8656.pdf
- PCN Packaging :
- ConflictMineralStatement :
IR2110PBF Overview
Its 14-DIP (0.300, 7.62mm) package is adopted for higher flexibility.Tube is the packaging method.There is a mounting bracket in the way of Through Hole.Gate drivers is able to show Gate driverss superiorGate driversy on the basis of a supply voltage of 3.3V~20V.Gate type IGBT, N-Channel MOSFET has been used in its design.This device can operate at temperatures up to -40°C~150°C TJ.The input type is Non-Inverting.The configuration starts with 14 terminations.Mosfet driver is possible to find various related parts under Mosfet drivers base part number IR2110PBF.The device is mounted using Through Hole.A total of 14 pins are available on the device.A supply voltage of 15V is required for operation.As a maximum, there is 2A limit to the output current.There are several useful electronic components within its subcategory MOSFET Drivers.High-side voltage - Max (Bootstrap) can be as low as 500V.The basis of this model has 2 outputs integrated.This device supports a current output of 2.5A at the output.Based on the maximum power dissipation of 1.6W, it is clear that it is capable of transferring and conducting power losses without becoming overheated.If you want a stable supply current, you should keep it at 340μA.In this case, it produces a voltage of 20V.Setting the operating supply voltage to 15V is recommended.The supply voltage is 340μA.A maximum voltage of 20V should be maintained for the output voltage.
IR2110PBF Features
Embedded in the Tube package
Employing a gate type of IGBT, N-Channel MOSFET
14 pins
High-side voltage - Max (Bootstrap) of 500V
Maximum power dissipation of 1.6W
IR2110PBF Applications
There are a lot of Infineon Technologies IR2110PBF gate drivers applications.
- Multicolor LED/laser displays
- Isolated switch mode power supplies (SMPS)
- Portable Media Players
- Motor Control
- DC/DC converters
- Refrigerator
- Broadcast equipment
- Portable Navigation Devices
- Smart Phones
- LCD/LCoS/DLP portable and embedded pico projectors
- ImagePart NumberManufacturerPackage / CaseNumber of PinsChannel TypeMax Output CurrentOutput CurrentRise TimeSupply VoltageMax Power DissipationView Compare
IR2110PBF
Infineon Technologies14-DIP (0.300, 7.62mm)
14
Independent
2 A
2.5 A
35 ns
15 V
1.6 W
- FAN7392NON Semiconductor
14-DIP (0.300, 7.62mm)
14
Independent
3 A
3 A
25 ns
15 V
1.6 W
IR2110PBF
VS
FAN7392N
- MIC4467ZNMicrochip Technology
14-DIP (0.300, 7.62mm)
14
Independent
1.2 A
1.2 A
25 ns
-
1.5 W
IR2110PBF
VS
MIC4467ZN
- MIC4469CNMicrochip Technology
14-DIP (0.300, 7.62mm)
-
Independent
-
-
-
-
-
IR2110PBF
VS
MIC4469CN
- MIC4468BNMicrochip Technology
14-DIP (0.300, 7.62mm)
-
Independent
-
-
-
-
-
IR2110PBF
VS
MIC4468BN
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
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How to pack electronic components in cartons?
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4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
