Texas Instruments SN74LVC07ADR
SN74LVC07ADR
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Texas Instruments SN74LVC07ADR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 5 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
14-SOIC (0.154, 3.90mm Width)
Number of Pins
14
Operating Temperature
-40°C~125°C TA
Packaging
Tape & Reel (TR)
Series
74LVC
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
14
Termination
SMD/SMT
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Subcategory
Gates
Packing Method
TR
Technology
CMOS
Voltage - Supply
1.65V~5.5V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
6
Supply Voltage
1.8V
Base Part Number
74LVC07
Pin Count
14
Output Type
Open Drain
Operating Supply Voltage
3.3V
Polarity
Non-Inverting
Supply Voltage-Max (Vsup)
5.5V
Load Capacitance
50pF
Number of Bits
10
Propagation Delay
2.6 ns
Quiescent Current
10μA
Turn On Delay Time
5.6 ns
Family
LVC/LCX/Z
Logic Function
Buffer, Inverting
Current - Output High, Low
- 24mA
Logic Type
Buffer, Non-Inverting
Max I(ol)
0.024 A
Number of Bits per Element
1
Schmitt Trigger
NO
Number of Input Lines
6
Height
1.75mm
Length
8.65mm
Width
3.91mm
Thickness
1.58mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Design/Specification :
- PCN Packaging :
- Datasheets :
SN74LVC07ADR Overview
Logical driver uses a neat 14-SOIC (0.154, 3.90mm Width) package. Tape & Reel (TR) external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 1.65V~5.5V. Qualified to operate within -40°C~125°C TA. The high and low logic state output current of logical driver is - 24mA. Logical driver can deal with Open Drain output (s). Digital buffer is one of the 74LVC series devices. 14 terminations with different functions. Buffer IC reuqires a supply voltage of 1.8V. Transceiver shares the LVC/LCX/Z family's comprehensive benefits and features. 14 pins are set with the electric part. Buffer IC is suitable for Surface Mount applications. Logical driver has 14 pins. The bus transceiver employs 1 bits for each element. You can search "74LVC07" for other related electrical components. Specifically, digital transciever is a kind of Gates. In quiescent state, the electronic part uses 10μA. It is generally sold in TR package. To run the part safely and stably in a circuit, 3.3V recommends users apply 3.3V on the logical driver. 10 bits are included within the electrical component. Because of its 6 lines level input capability, buffer IC is more cost-effective on transimitting signals.
SN74LVC07ADR Features
Gates
SN74LVC07ADR Applications
There are a lot of Texas Instruments SN74LVC07ADR Buffers & Transceivers applications.
- Wireless projection application for conferences and business talks
- Wireless smart house
- Wireless transmission
- Portable radio
- Switches/bridges/routers/servers
- Relays
- Lamps
- Radio transmission
- Automation systems
- Wireless communication
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLogic FunctionPropagation DelaySupply VoltageQuiescent CurrentRadiation HardeningMounting TypeView Compare
SN74LVC07ADR
NA14-SOIC (0.154, 3.90mm Width)
14
Buffer, Inverting
2.6 ns
1.8 V
10 μA
No
Surface Mount
- SN74LV07ADNA
14-SOIC (0.154, 3.90mm Width)
14
Buffer, Inverting
7.5 ns
2.5 V
20 μA
No
Surface Mount
SN74LVC07ADR
VS
SN74LV07AD
- SN74LV07ADRNA
14-SOIC (0.154, 3.90mm Width)
14
Buffer, Inverting
7.5 ns
2.5 V
20 μA
No
Surface Mount
SN74LVC07ADR
VS
SN74LV07ADR
- SN74LVC06ADRNA
14-SOIC (0.154, 3.90mm Width)
14
Buffer, Inverter
7.6 ns
1.8 V
1 μA
No
Surface Mount
SN74LVC07ADR
VS
SN74LVC06ADR
74AC05SCXON Semiconductor14-SOIC (0.154, 3.90mm Width)
14
Buffer, Inverter
14.5 ns
-
4 μA
No
Surface Mount
SN74LVC07ADR
VS
74AC05SCX
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How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT, SF Express.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does ICHOME mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s SN74LVC07ADR price and stock displayed on the website accurate?
ICHOME inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with ICHOME salesperson or online customer service before payment.
You Also Ask
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
