Texas Instruments DRV8825PWP
DRV8825PWP
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Texas Instruments DRV8825PWP information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 3 days ago)
Mount
Through Hole
Mounting Type
Surface Mount
Package / Case
28-PowerTSSOP (0.173, 4.40mm Width)
Number of Pins
28
Weight
120.003531mg
Operating Temperature
-40°C~150°C TJ
Packaging
Tube
Tolerance
20%
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
28
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Applications
General Purpose
Voltage - Rated
100V
Capacitance
47μF
Subcategory
Motion Control Electronics
Voltage - Rated DC
100V
Technology
Power MOSFET
Voltage - Supply
8.2V~45V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
24V
Terminal Pitch
0.65mm
Base Part Number
DRV8825
Function
Driver - Fully Integrated, Control and Power Stage
Lead Pitch
3.5mm
Output Voltage
3.3V
Number of Channels
2
Interface
Logic
Analog IC - Other Type
BRUSH DC MOTOR CONTROLLER
Operating Supply Current
5mA
Output Configuration
Half Bridge (4)
Current - Output
2.5A
Logic Function
AND
Supply Current-Max (Isup)
8mA
Collector Emitter Voltage (VCEO)
45V
Max Collector Current
1.8A
Voltage - Load
8.2V~45V
Switching Frequency
30kHz
Motor Type
Stepper
Motor Type - Stepper
Bipolar
Step Resolution
1 ~ 1/32
Diameter
8mm
Height
1.2mm
Length
9.7mm
Width
4.4mm
Thickness
1mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
DRV8825PWP Description
DRV8825PWP provides an integrated motor driver solution for printer scanners and other automation equipment applications. The device has two H-bridge drivers and a micro-step divider designed to drive bipolar stepper motors. The output driver block consists of an N-channel power MOSFET configured as a full H-bridge to drive the motor winding. DRV8825 can drive up to 2.5 amperes per output (appropriate heat dissipation at 24 volts and 25 °C).The simple step / DIR interface allows easy connection to the controller circuit. The mode pin allows the motor to operate continuously in a full-step to 1-step 32-step mode. Falloff modes can be configured to use slow falloff, fast falloff, or mixed falloff. A low power sleep mode is provided, which closes the internal circuit to achieve very low static current consumption. The hibernation mode can be set using the designed nSLEEP pin.With over-current, short-circuit, under-voltage locking, high temperature and other internal shutdown functions. The fault status is indicated by the nFAULT pin.
DRV8825PWP Features
PWM Microstepping Stepper Motor Driver -Built-In Microstepping Indexer -Upto1/32Microstepping
Multiple Decay Modes
Mixed Decay
Slow Decay
-Fast Decay
8.2-V to 45-V Operating Supply Voltage Range
2.5-A Maximum Drive Current at 24 Vand TA=25C
Simple STEP/DIR Interface
Low Current Sleep Mode
Built-In 3.3-V Reference Output
Small Package and Footprint
Protection Features
-Overcurrent Protection(OCP) -Thermal Shutdown(TSD)
-VM Undervoltage Lockout(UVLO
-Fault Condition indication Pin(nFAULT)
DRV8825PWP Applications
Automatic Teller Machines
Money Handling Machines
Video Security Cameras
Printers
Scanners
Office Automation Machines
Gaming Machines
Factory Automation
Robotics
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLogic FunctionInterfaceSupply VoltageRadiation HardeningREACH SVHCLead FreeView Compare
DRV8825PWP
NA28-PowerTSSOP (0.173, 4.40mm Width)
28
AND
Logic
24 V
No
No SVHC
Lead Free
L6474HSTMicroelectronics28-TSSOP (0.173, 4.40mm Width) Exposed Pad
28
AND
SPI
3.3 V
No
No SVHC
Lead Free
DRV8825PWP
VS
L6474H
DRV8840PWPNA28-PowerTSSOP (0.173, 4.40mm Width)
28
AND
Parallel
24 V
No
No SVHC
Lead Free
DRV8825PWP
VS
DRV8840PWP
- DRV8841PWPRNA
28-PowerTSSOP (0.173, 4.40mm Width)
28
AND
Parallel
24 V
No
No SVHC
Lead Free
DRV8825PWP
VS
DRV8841PWPR
- DRV8824PWPNA
28-PowerTSSOP (0.173, 4.40mm Width)
28
AND
Logic
24 V
No
No SVHC
Lead Free
DRV8825PWP
VS
DRV8824PWP
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How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT, SF Express.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does ICHOME mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s DRV8825PWP price and stock displayed on the website accurate?
ICHOME inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with ICHOME salesperson or online customer service before payment.
You Also Ask
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
