Microchip Technology SY89297UMG
SY89297UMG
In Stock:94131
Qty
Unit Price
Ext Price
1
$13.280000
$13.280000
10
$12.526000
$125.260000
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Microchip Technology SY89297UMG information
Type
Parameter
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
24-VFQFN Exposed Pad
Number of Pins
24
Supplier Device Package
24-QFN (4x4)
Operating Temperature
-40°C~85°C
Packaging
Tube
Published
2011
Series
Precision Edge®
Part Status
Active
Moisture Sensitivity Level (MSL)
2 (1 Year)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Voltage - Supply
2.375V~3.6V
Depth
4mm
Base Part Number
SY89297
Function
Multiple, Programmable
Number of Outputs
2
Output Voltage
2.5V
Number of Channels
2
Interface
Parallel, Serial
Max Supply Voltage
2.625V
Min Supply Voltage
2.375V
Nominal Supply Current
195mA
Propagation Delay
1 ns
Number of Taps
1024
Number of Taps/Steps
1024
Number of Independent Delays
2
Delay to 1st Tap
2ns
Available Total Delays
2ns ~ 7.5ns
Tap Increment
5ps
Length
4mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- PCN Part Status Change :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
SY89297UMG Overview
The package is designed to be as cost-effective as possible by utilizing Tube. In applications requiring additional insulation, the 24-VFQFN Exposed Pad package can be used instead. The supply voltage of 2.375V~3.6V makes reliable performance possible. The technique of Surface Mount is employed as its mounting type. A temperature range of -40°C~85°C is available. The device is configured with 1024 taps/steps. It has been found that a number of related parts with the same base part number SY89297 are universally preferred for a variety of applications. It is mounted in the way of Surface Mount. A group of 24 pins has been arranged in its design. The supplier device package is 24-QFN (4x4). To maintain optimal operation, the maximum operating temperature should be 85°C. In order to maintain optimal performance, it is recommended that the operating temperature be kept at -40°C. The device is part of the Precision Edge? series, which are among the most important electronic devices. Depending on the model, it can support a maximum supply voltage of 2.625V. This device supports a minimum supply voltage of 2.375V.
SY89297UMG Features
Supply voltage at Tube volts
Mounting Type: Precision Edge?
Clock Frequency: 2.375V
SY89297UMG Applications
There are a lot of Microchip Technology SY89297UMG Delay Lines Timing ICs applications.
- Aperture Centering
- Switch Debouncing
- Digital Systems
- Clock De-Skewing
- Noise Discriminators/Pulse Qualifiers
- Digital Test Equipment
- Transponder design
- Telecommunications
- System Calibration
- QDR/QDRII Memory Systems
- ImagePart NumberManufacturerPackage / CaseNumber of PinsInterfaceMin Supply VoltageMax Supply VoltageLengthMountMounting TypeView Compare
SY89297UMG
Microchip Technology24-VFQFN Exposed Pad
24
Parallel, Serial
2.375 V
2.625 V
4 mm
Surface Mount
Surface Mount
MAX7312ATG+Maxim Integrated24-WFQFN Exposed Pad
24
I2C, SMBus
-
-
4 mm
Surface Mount
Surface Mount
SY89297UMG
VS
MAX7312ATG+
STPM32TRSTMicroelectronics24-VQFN Exposed Pad
24
SPI
-
-
4 mm
Surface Mount
Surface Mount
SY89297UMG
VS
STPM32TR
- MCP23S18-E/MJMicrochip Technology
24-VFQFN Exposed Pad
24
SPI
-
-
4 mm
Surface Mount
Surface Mount
SY89297UMG
VS
MCP23S18-E/MJ
- MCP23S18T-E/MJMicrochip Technology
24-VFQFN Exposed Pad
24
SPI
-
-
4 mm
Surface Mount
Surface Mount
SY89297UMG
VS
MCP23S18T-E/MJ
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
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