Maxim Integrated DS1990A-F5+
DS1990A-F5+
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Maxim Integrated DS1990A-F5+ information
Type
Parameter
Factory Lead Time
6 Weeks
Mount
Surface Mount
Number of Pins
2
Operating Temperature
-40°C~85°C
Published
2003
Series
iButton®
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
2
ECCN Code
EAR99
Terminal Finish
MATTE TIN
Applications
Product Identification
Subcategory
Other Memory ICs
Technology
MOS
Terminal Position
END
Number of Functions
1
Supply Voltage
3.3V
Base Part Number
DS1990A
Pin Count
2
Power Supplies
3/5V
Max Supply Voltage
6V
Min Supply Voltage
2.8V
Memory Size
8B
Memory Type
ROM
Organization
64X1
Memory Density
64 bit
Access Time (Max)
15000 ns
Parallel/Serial
SERIAL
Serial Bus Type
1-WIRE
Height
6.45mm
Length
17.35mm
Width
17.35mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Other Related Documents :
- Application Notes :
maximintegrated-ds1996lf5-applicationnotes-3797.pdf
maximintegrated-ds1402ddr8-applicationnotes-9347.pdf
- ConflictMineralStatement :
maximintegrated-ds1075z66n-conflictmineralstatement-7504.pdf
- ImagePart NumberManufacturerNumber of PinsMin Supply VoltageSupply VoltageMax Supply VoltageFactory Lead TimeNumber of TerminationsRoHS StatusView Compare
DS1990A-F5+
Maxim Integrated2
2.8 V
3.3 V
6 V
6 Weeks
2
ROHS3 Compliant
DS1971-F5+Maxim Integrated2
2.8 V
5 V
6 V
6 Weeks
2
ROHS3 Compliant
DS1990A-F5+
VS
DS1971-F5+
DS1990R-F5#Maxim Integrated2
2.8 V
5 V
6 V
6 Weeks
2
ROHS3 Compliant
DS1990A-F5+
VS
DS1990R-F5#
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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2.Are the Maxim Integrated's DS1990A-F5+ price and stock displayed on the website accurate?
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You Also Ask
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
