IXYS / Littelfuse

After achieving the acquisition of IXYS, Littelfuse expands the breadth of its power semiconductor portfolio, with solutions spanning a large extent of technologies. We are delicated to providing the excellent technology and enhanced, differentiated capabilities in target markets and geographies. In the meantime, we deliver more industry access and raise growth opportunities. The three business units Littelfuse Inc. merged into IXYS a Littelfuse Technology are integrated into its portfolio. IXYS a Littelfuse Technology is a global premier power semiconductor manufacturer. In th filed of industrial, transportation, telecommunications, computer, medical, consumer and clean tech markets, they not only focus on specialized power semiconductors, integrated circuits and RF power include low on-resistance Power MOSFETs, Ultra Fast switching IGBTs, Fast Recovery Diodes (FREDs), SCR and Diode Modules, but also Rectifier Bridges, and Power Interface ICs for applications. IXYS Integrated Circuits Division formerly Clare, Inc. is owned by Littelfuse now. They are delicated in designing, manufacturing, and marketing high-voltage integrated circuits (ICs) and optically isolated Solid State Relays (OptoMOS®). They serve for the communication, industrial, power, and consumer markets. It is a pioneer to develop Solid State Relays (SSRs). In the meantime, it is a leader among the global suppliers in the field of the telecommunications, security, utility metering, and industrial control industries.The IXYS Integrated Circuits Division SSR solution effectively replaces the old electromechanical equipment and improves the overall system performance. They focus on developing products with higher integration and electrical performance characteristics. High-performance MOSFETs, drivers and integrated modules using DE series packages are products that the IXYS RF/Littelfuse brand has always provided. The design team of IXYS/Littelfuse has rich experience. They developed a chip specifically for the DE series package. At the same time, they use available industry standard packaging to make their technology available for a wider range of applications and markets.