Xilinx Inc. XC6SLX150-3FGG900I
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Xilinx Inc. XC6SLX150-3FGG900I information
Type
Parameter
Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
900-BBGA
Number of Pins
900
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2006
Series
Spartan®-6 LX
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
900
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.14V~1.26V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
1.2V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
30
Base Part Number
XC6SLX150
Pin Count
900
Number of Outputs
576
Qualification Status
Not Qualified
Operating Supply Voltage
1.2V
Number of I/O
576
RAM Size
603kB
Clock Frequency
862MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
147443
Total RAM Bits
4939776
Number of LABs/CLBs
11519
Speed Grade
3
Number of Registers
184304
Combinatorial Delay of a CLB-Max
0.21 ns
Height Seated (Max)
2.6mm
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
XC6SLX150-3FGG900I Overview
A 900-BBGA package contains it, and it is available for download. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. A total of 576 I/Os allow data to be transferred in a more coherent manner. In order to construct a fundamental building block, 147443 logic elements/cells are required. Power is provided by a 1.2V-volt supply. There is a Field Programmable Gate Arrays family component in this FPGA part. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates at a voltage of 1.14V~1.26V and uses a battery to supply power. The FPGA belongs to the Spartan?-6 LX series of FPGAs, and it is one type of FPGA. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. During the installation of this device, 576 outputs were incorporated. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, the terminations of this piece are 900. This device is equipped with 4939776 RAM bits in terms of its RAM si4939776e. For related parts, use its base part number XC6SLX150. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. This cable has 900 pins and is designed to connect to a computer. A total of 11519 LABs/CLBs make up this FPGA array. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. With a 1.2V supply voltage, designers can fully utilize the flexibility of the device. There are a total of 900 pins on this device. Typically, fpga semiconductor uses a crystal oscillating at 862MHz . The structure of the registers used to store and transfer data consists of 184304 registers.
XC6SLX150-3FGG900I Features
576 I/Os
Up to 4939776 RAM bits
900 LABs/CLBs
184304 registers
XC6SLX150-3FGG900I Applications
There are a lot of Xilinx Inc. XC6SLX150-3FGG900I FPGAs applications.
- Development Boards and Shields for Microcontrollers
- Aircraft navigation
- Distributed Monetary Systems
- Military DSP
- Aerospace and Defense
- Random logic
- Camera time adjustments
- Video & Image Processing
- Audio
- DO-254
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Logic Elements/CellsNumber of I/ORAM SizeSupply VoltageTerminal PositionTerminal PitchView Compare
XC6SLX150-3FGG900I
Xilinx Inc.900-BBGA
900
147443
576
603 kB
1.2 V
BOTTOM
1 mm
EP4CGX150DF27C8NAlteraFBGA
672
149760
-
810 kB
1.2 V
BOTTOM
1 mm
XC6SLX150-3FGG900I
VS
EP4CGX150DF27C8N
EP4CGX150DF27C7NAlteraFBGA
672
149760
-
810 kB
1.2 V
BOTTOM
1 mm
XC6SLX150-3FGG900I
VS
EP4CGX150DF27C7N
EP4CGX150DF31C7NAlteraFBGA
896
149760
-
810 kB
1.2 V
BOTTOM
1 mm
XC6SLX150-3FGG900I
VS
EP4CGX150DF31C7N
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