Infineon Technologies BAR6405E6327HTSA1
BAR6405E6327HTSA1
In Stock:94131
Qty
Unit Price
Ext Price
1
$0.190000
$0.190000
500
$0.138760
$69.380000
1000
$0.115630
$115.630000
2000
$0.106080
$212.160000
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Infineon Technologies BAR6405E6327HTSA1 information
Type
Parameter
Factory Lead Time
4 Weeks
Mount
Surface Mount
Package / Case
TO-236-3, SC-59, SOT-23-3
Number of Pins
3
Diode Element Material
SILICON
Operating Temperature
150°C TJ
Packaging
Tape & Reel (TR)
Published
2002
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
3
ECCN Code
EAR99
Terminal Finish
Tin (Sn)
Voltage - Rated DC
150V
Technology
POSITIVE-INTRINSIC-NEGATIVE
Terminal Form
GULL WING
Current Rating
100mA
Base Part Number
BAR64-05
Reference Standard
AEC-Q101
Number of Elements
2
Element Configuration
Dual
Diode Type
PIN - 1 Pair Common Cathode
Power Dissipation
250mW
Forward Current
100mA
Application
ATTENUATOR; SWITCHING
Forward Voltage
1.1V
Reverse Recovery Time
1.55 μs
Capacitance @ Vr, F
0.35pF @ 20V 1MHz
Reverse Voltage
150V
Frequency Band
C B
Resistance @ If, F
1.35Ohm @ 100mA 100MHz
Minority Carrier Lifetime-Nom
1.55 µs
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Other Related Documents :
infineontechnologies-tda5200xuma1-otherrelateddocuments-8656.pdf
- PCN Design/Specification :
- PCN Packaging :
- Datasheets :
- ConflictMineralStatement :
BAR6405E6327HTSA1 Overview
The forward voltage should be kept above 1.1V V.This part has a current rating of 100mA.
BAR6405E6327HTSA1 Features
BAR6405E6327HTSA1 Applications
There are a lot of Infineon Technologies BAR6405E6327HTSA1 applications of RF diodes.
- RF attenuators
- Broadband system applications i.e. WCDMA, CATV, etc.
- Clamping circuits
- Radar systems and modules
- Wearables
- Low diode forward resistance
- Low loss band-switching in VHF television tuners
- UHF mixer
- RF detector
- Car radio
- ImagePart NumberManufacturerMountPackage / CaseForward VoltageForward CurrentReverse Recovery TimeNumber of TerminationsNumber of PinsDiode Element MaterialView Compare
BAR6405E6327HTSA1
Infineon TechnologiesSurface Mount
TO-236-3, SC-59, SOT-23-3
1.1 V
100 mA
1.55 μs
3
3
SILICON
BZX84C4V7-7-FDiodes IncorporatedSurface Mount
TO-236-3, SC-59, SOT-23-3
900 mV
-
-
3
3
SILICON
BAR6405E6327HTSA1
VS
BZX84C4V7-7-F
- MMBZ5226B-7-FDiodes Incorporated
Surface Mount
TO-236-3, SC-59, SOT-23-3
900 mV
-
-
3
3
SILICON
BAR6405E6327HTSA1
VS
MMBZ5226B-7-F
- MMBD1202ON Semiconductor
Surface Mount
TO-236-3, SC-59, SOT-23-3
1.1 V
200 mA
4 ns
3
3
SILICON
BAR6405E6327HTSA1
VS
MMBD1202
MMBZ4624-E3-08Vishay Semiconductor Diodes DivisionSurface Mount
TO-236-3, SC-59, SOT-23-3
1.1 V
200 mA
-
3
3
SILICON
BAR6405E6327HTSA1
VS
MMBZ4624-E3-08
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You Also Ask
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After the electronic components have passed the quality inspection of ICHOME, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
