STMicroelectronics LIS3DHTR Datasheet
The LIS3DHTR is an ultra-low-power, high-performance 3-axis linear accelerometer belonging to STMicroelectronics' "nano" family. Featuring digital I2C and SPI serial interfaces, this sensor delivers dynamically user-selectable full scales of ±2g, ±4g, ±8g, and ±16g, alongside output data rates from 1 Hz to 5.3 kHz. It features an embedded 32-level FIFO buffer, an integrated temperature sensor, and a 10-bit auxiliary ADC.
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Part Number: LIS3DHTR
Manufacturer: STMicroelectronics
Stock: 20k pcs
Date Code: 25+
Package: LGA-16
Technical Specifications of LIS3DHTR
| Parameter | Specification |
| Manufacturer | STMicroelectronics |
| Operating Temperature Range | -40°C to +85°C (Industrial Grade) |
| Supply Voltage | 1.71V to 3.6V |
| I/O Supply Voltage | 1.71 V to Vdd + 0.1V |
| Package / Case | LGA-16 (3 mm x 3 mm x 1 mm) |
| Packaging Type | Tape & Reel (TR) |
| Full-Scale Ranges | ± 2g, ± 4g, ± 8g, ± 16g |
| Low-Power Current Consumption | Down to 2 μA |
| Compliance | RoHS, and "Green" compliant |
Supply Chain Insights
Standard factory lead times for ST Motion MEMS sensors can extend up to 16–26 weeks depending on global demand cycles. ICHOME maintains buffer stock to help procurement teams bypass long factory allocation cycles and prevent line-down situations.
Alternative & Equivalent Part Numbers of LIS3DHTR
When managing supply disruptions or long factory lead times, consider these functional equivalents:
LIS3DSH: A direct pin-compatible alternative from STMicroelectronics featuring an embedded finite state machine for custom motion processing routines.
LIS2DH12TR: Another ST ultra-low-power 3-axis accelerometer in an LGA-12 package for footprint-constrained redesigns requiring lower active current draw.
Key Applications of LIS3DHTR
The LIS3DHTR is widely integrated into industrial, consumer, and IoT electronics:
Motion-activated power saving in battery-operated handheld devices
Free-fall detection and 6D/4D orientation sensing in mobile systems
Vibration monitoring, impact logging, and predictive maintenance in machinery
Asset tracking, pedometers, gaming inputs, and virtual reality peripherals
Package & Pinout Information of LIS3DHTR
The LIS3DHTR comes in a standard plastic 16-pin Land Grid Array (LGA-16) package.
Dimensions: 3x mm x 3mm x 1 xmm
What Is the Difference Between LIS3DHTR and LIS3DH?
The core functional silicon chip is identical. The suffix "TR" designates the packaging format: "TR" specifies Tape & Reel packaging intended for automated high-speed SMT assembly lines, whereas "LIS3DH" typically refers to the base part family name or tray/tube packaging options in engineering documentation.
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